FDMC2610 Fairchild Semiconductor, FDMC2610 Datasheet

FDMC2610

Manufacturer Part Number

FDMC2610

Description

MOSFET N-CH 200V 2.2A POWER33-8

Manufacturer

Fairchild Semiconductor

Series

UniFET™r

Datasheet

1.FDMC2610.pdf (7 pages)

Specifications of FDMC2610

Fet Type

MOSFET N-Channel, Metal Oxide

Fet Feature

Logic Level Gate

Rds On (max) @ Id, Vgs

200 mOhm @ 2.2A, 10V

Drain To Source Voltage (vdss)

200V

Current - Continuous Drain (id) @ 25° C

2.2A

Vgs(th) (max) @ Id

4V @ 250µA

Gate Charge (qg) @ Vgs

18nC @ 10V

Input Capacitance (ciss) @ Vds

960pF @ 100V

Power - Max

2.1W

Mounting Type

Surface Mount

Package / Case

8-MLP, Power33

Configuration

Single Quad Drain Triple Source

Transistor Polarity

N-Channel

Resistance Drain-source Rds (on)

0.2 Ohms

Forward Transconductance Gfs (max / Min)

7 S

Drain-source Breakdown Voltage

200 V

Gate-source Breakdown Voltage

+/- 20 V

Continuous Drain Current

9.5 A

Power Dissipation

42 W

Maximum Operating Temperature

+ 150 C

Mounting Style

SMD/SMT

Minimum Operating Temperature

- 55 C

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

FDMC2610TR

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Meier Automation Equipment Co., Limited

Part Number:

FDMC2610

Manufacturer:

FAIRCHILD/ON

Quantity:

20 000

Company:

H&T Electronics

Part Number:

FDMC2610

Quantity:

3 000

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This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence. This is a preliminary

notification. A Final PCN will be issued when qualification is complete and data is available.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

If you have any questions concerning this change, please contact:

PCN Originator:

Name: Lam, HH

E-mail: HH.Lam@fairchildsemi.com

Phone: 604 850 2392

Implementation of change:

Expected 1st Device Shipment Date: 2008/02/10

Earliest Year/Work Week of Changed Product: 0812

Change Type Description: Mold Compound

Description of Change (From): FPG 8L MLP3x3 package assembly at all FSC approved

manufacturing location(s) (Carsem) using non Green mold compound as shown in table 1.

Description of Change (To): FPG 8L MLP 3x3 package assembly at all FSC approved

manufacturing location(s) (Carsem) using Green mold compound as shown in table 2.

Reason for Change : Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is

dedicated to being a good corporate citizen. All Fairchild Semiconductor products are 2nd level

interconnect lead-free and RoHS compliance. The referenced material changes have been made

to provide a 'Full Green' (Halogen Free Flame Retardant) package. For additional details on the

corporate wide green initiative please visit our Web site at:

http://www.fairchildsemi.com/company/green/index.html Manufacturing will occur at the same

assembly facilities producing the current non-green products. Package outline drawings of the

affected products remain un-changed. Green products will be fully compliant to all published

data sheet specifications and will be interchangeable with current non-green product. Quality

and reliability will remain at the highest standards already demonstrated with Fairchild's

existing products.

Qual/REL Plan Numbers : Q20070296

Qualification :

Qualification of Carsem FPG 8L MLP 3x3 with Green EMC (G600)

Change From

Technical Contact:

Name: Yeoh, LiangChoon

E-mail: Liang.Yeoh@fairchildsemi.com

Phone: 604 850 2744

FORECAST CHANGE NOTIFICATION

Date Issued On : 2007/11/30

Date Created : 2007/11/12

PCN# : Q4074601

Pg. 1

Related parts for FDMC2610

FDMC2610 Summary of contents

Page 1

... This notification is for your information and concurrence. This is a preliminary notification. A Final PCN will be issued when qualification is complete and data is available. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. If you have any questions concerning this change, please contact: ...

Page 2

Change To Qualification Stress Test and Sample Size Detail Device #1 FDM6296 Package: #Leads: Precondition Description: Stress P/C Standard PCNL1A JESD22-A113 Environment Stress Detail: Stress P/C Standard HAST2 X JESD22-A110 85%RH, 110C, PRCL MIL- STD-750-1036 TMCL1 X JESD22-A104 -65C, 150C ...

Page 3

... Min cycle 100 500 Conditions Readpoints Conditions TP1 TP2 264 24V 168 500 168 500 Delta 100CC, 2 5000 10000 Min cycle 100 500 FDM3300NZ_NL FDM6296 FDMC2610 FDMC5614P FDMC8878 A 0 Samples TP3 1000 77 1000 Read- Sample points A 0 Samples TP3 A ...

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