TJA1050TD NXP Semiconductors, TJA1050TD Datasheet - Page 13
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TJA1050TD
Manufacturer Part Number
TJA1050TD
Description
Network Controller & Processor ICs HI SPD CAN TRANSCVR
Manufacturer
NXP Semiconductors
Datasheet
1.TJA1050TN1118.pdf
(18 pages)
Specifications of TJA1050TD
Product
Controller Area Network (CAN)
Number Of Transceivers
1
Data Rate
1 MBd
Supply Voltage (max)
5.25 V
Supply Voltage (min)
4.75 V
Supply Current (max)
10 mA
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Package / Case
SOIC-8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
TJA1050T/N1,112
Philips Semiconductors
BONDING PAD LOCATIONS
Note
1. All x/y coordinates represent the position of the centre
2003 Oct 22
TXD
GND
V
RXD
V
CANL
CANH
S
CC
ref
High speed CAN transceiver
SYMBOL
of each pad (in m) with respect to the lefthand bottom
corner of the top aluminium layer (see Fig.13).
PAD
1
2
3
4
5
6
7
8
1371.5
886.5
538.5
1394
103
740
998
103
COORDINATES
x
1094
1115
1115
1097
103
111
111
(1)
85
y
13
handbook, halfpage
The backside of the bare die must be connected to ground.
x
Fig.13 Bonding pad locations.
0
0
y
8
1
TJA1050U
7
2 3
6
Product specification
MGS381
5
4
TJA1050
test pad