IRF820ASPBF Vishay, IRF820ASPBF Datasheet - Page 2

MOSFET N-CH 500V 2.5A D2PAK

IRF820ASPBF

Manufacturer Part Number
IRF820ASPBF
Description
MOSFET N-CH 500V 2.5A D2PAK
Manufacturer
Vishay
Datasheet

Specifications of IRF820ASPBF

Transistor Polarity
N-Channel
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
3 Ohm @ 1.5A, 10V
Drain To Source Voltage (vdss)
500V
Current - Continuous Drain (id) @ 25° C
2.5A
Vgs(th) (max) @ Id
4.5V @ 250µA
Gate Charge (qg) @ Vgs
17nC @ 10V
Input Capacitance (ciss) @ Vds
340pF @ 25V
Power - Max
50W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Minimum Operating Temperature
- 55 C
Configuration
Single
Resistance Drain-source Rds (on)
3 Ohm @ 10 V
Drain-source Breakdown Voltage
500 V
Gate-source Breakdown Voltage
+/- 30 V
Continuous Drain Current
2.5 A
Power Dissipation
50000 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Continuous Drain Current Id
2.5A
Drain Source Voltage Vds
500V
On Resistance Rds(on)
3ohm
Rds(on) Test Voltage Vgs
10V
Leaded Process Compatible
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
*IRF820ASPBF
Diode Characteristics
Dynamic @ T
Avalanche Characteristics
Thermal Resistance
Document Number: 91058
Static @ T
E
I
E
R
R
V
∆V
R
V
I
I
g
Q
Q
Q
t
t
t
t
C
C
C
C
C
C
I
I
V
t
Q
t
AR
DSS
GSS
d(on)
r
d(off)
f
SM
S
rr
on
fs
AS
AR
(BR)DSS
DS(on)
GS(th)
θJC
θJA
iss
oss
rss
oss
oss
oss
SD
g
gs
gd
rr
(BR)DSS
eff.
/∆T
J
Breakdown Voltage Temp. Coefficient
Drain-to-Source Breakdown Voltage
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Forward Transconductance
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Output Capacitance
Output Capacitance
Effective Output Capacitance
Drain-to-Source Leakage Current
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode) †
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
Forward Turn-On Time
J
= 25°C (unless otherwise specified)
J
Single Pulse Avalanche Energy‚†
Avalanche Current
Repetitive Avalanche Energy
Junction-to-Case
Junction-to-Ambient ( PCB Mounted, steady-state)*
= 25°C (unless otherwise specified)
Parameter
Parameter
Parameter
Parameter
Parameter
–––
500
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Min. Typ. Max. Units
2.0
Min. Typ. Max. Units
1.4
Min. Typ. Max. Units
–––
–––
–––
–––
–––
Intrinsic turn-on time is negligible (turn-on is dominated by L
0.60
–––
–––
–––
–––
–––
–––
––– -100
–––
–––
–––
–––
340
490
760 1140
–––
–––
–––
330
8.1
2.7
12
16
13
53
15
28
–––
–––
250
100
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
500
3.0
4.5
4.3
8.5
1.6
25
17
2.5
10
V/°C
µA
nA
nC
ns
nC
pF
ns
V
V
S
V
Typ.
–––
–––
–––
Typ.
–––
–––
V
V
V
V
V
V
V
V
V
V
V
I
R
R
V
V
ƒ = 1.0MHz, See Fig. 5†
V
V
V
MOSFET symbol
showing the
integral reverse
p-n junction diode.
T
T
di/dt = 100A/µs „†
Reference to 25°C, I
I
D
D
GS
GS
DS
DS
DS
GS
GS
DS
DS
GS
DD
G
D
GS
DS
GS
GS
GS
J
J
= 2.5A
= 2.5A
= 25°C, I
= 25°C, I
= 97Ω,See Fig. 10
= 21Ω
= V
= 500V, V
= 400V, V
= 400V
= 25V
= 0V, I
= 10V, I
= 30V
= -30V
= 50V, I
= 10V, See Fig. 6 and 13 „†
= 250V
= 0V
= 0V, V
= 0V, V
= 0V, V
GS
, I
D
S
F
DS
D
D
D
DS
DS
Conditions
= 250µA
Conditions
Conditions
= 2.5A, V
= 2.5A
= 250µA
= 1.5A
= 1.5A†
GS
GS
= 0V to 400V …†
Max.
Max.
= 1.0V, ƒ = 1.0MHz
= 400V, ƒ = 1.0MHz
140
2.5
5.0
2.5
62
= 0V, T
= 0V
D
= 1mA †
www.vishay.com
GS
„†
J
G
= 0V „
= 125°C
Units
Units
S
°C/W
+L
mJ
mJ
A
D
S
D
)
2

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