APT13F120B Microsemi Power Products Group, APT13F120B Datasheet - Page 4

• Manufacturer Part Number: APT13F120B
• Description: MOSFET N-CH 1200V 13A TO-247
• Manufacturer: Microsemi Power Products Group

Specifications of APT13F120B

• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Standard
• Rds On (max) @ Id, Vgs: 1.4 Ohm @ 7A, 10V
• Drain To Source Voltage (vdss): 1200V (1.2kV)
• Current - Continuous Drain (id) @ 25° C: 13A
• Vgs(th) (max) @ Id: 5V @ 1mA
• Gate Charge (qg) @ Vgs: 145nC @ 10V
• Input Capacitance (ciss) @ Vds: 4765pF @ 25V
• Power - Max: 625W
• Mounting Type: Through Hole
• Package / Case: TO-247
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: APT13F120BMI; APT13F120BMI

Microsemi's products are covered by one or more of U.S.patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786
5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. US and Foreign patents pending. All Rights Reserved.
0.40 (.016)
0.79 (.031)
2.21 (.087)
2.59 (.102)
0.25
0.20
0.15
0.10
0.05
4.69 (.185)
5.31 (.209)
1.49 (.059)
2.49 (.098)
100
0.1
10
1
0
10
1
Dimensions in Millimeters and (Inches)
T
-5
T
Figure 9, Forward Safe Operating Area
J
V
C
=
DS
=
I
125°C
20.80 (.819)
21.46 (.845)
19.81 (.780)
20.32 (.800)
DM
75°C
, DRAIN-TO-SOURCE VOLTAGE (V)
D = 0.9
TO-247 (B) Package Outline
R ds(on)
Dissipated Power
0.7
0.3
0.1
6.15 (.242) BSC
0.5
0.05
4.50 (.177) Max.
10
Figure 12. Maximum Effective Transient Thermal Impedance Junction-to-Case vs Pulse Duration
1.01 (.040)
1.40 (.055)
5.45 (.215) BSC
2-Plcs.
13µs
(Watts)
100µs
1ms
10ms
100ms
DC line
10
15.49 (.610)
16.26 (.640)
-4
100
Figure 11, Transient Thermal Impedance Model
5.38 (.212)
6.20 (.244)
3.50 (.138)
3.81 (.150)
2.87 (.113)
3.12 (.123)
1.65 (.065)
2.13 (.084)
Gate
Drain
Source
T
J
RECTANGULAR PULSE DURATION (seconds)
(°C)
1200
0.00457
0.0166
10
SINGLE PULSE
-3
e3 100% Sn Plated
0.0176
0.0688
0.270
0.114
4.98 (.196)
5.08 (.200)
1.47 (.058)
1.57 (.062)
0.46 (.018)
0.56 (.022)
0.020 (.001)
0.178 (.007)
2.67 (.105)
2.84 (.112)
10
100
0.1
10
Figure 10, Maximum Forward Safe Operating Area
T
-2
1
C
1
(°C)
{3 Plcs}
Scaling for Different Case & Junction
Temperatures:
T
T
V
R ds(on)
J
C
I
1.22 (.048)
1.32 (.052)
D
DS
=
=
=
I
150°C
D
DM
, DRAIN-TO-SOURCE VOLTAGE (V)
25°C
I
D(T
Dimensions in Millimeters (Inches)
3
PAK Package Outline
C
= 25
Z
impedances: Case to sink,
sink to ambient, etc. Set to
zero when modeling only
the case to junction.
Note:
10
EXT
Peak T J = P DM x Z θJC + T C
15.95 (.628)
16.05(.632)
°
Revised
C)
4/18/95
are the external thermal
Duty Factor D =
*(
100µs
t
1
10
13µs
T
= Pulse Duration
J
1ms
10ms
100ms
-1
-
1.98 (.078)
2.08 (.082)
5.45 (.215) BSC
{2 Plcs.}
DC line
t 1
T
Gate
C
)/125
13.79 (.543)
13.99(.551)
t 2
Drain
100
Source
1.04 (.041)
1.15(.045)
1.27 (.050)
1.40 (.055)
t 1
/
t 2
APT13F120B_S
13.41 (.528)
13.51(.532)
1200
1.0
Revised
8/29/97
Heat Sink (Drain)
and Leads
are Plated
3.81 (.150)
4.06 (.160)
(Base of Lead)
11.51 (.453)
11.61 (.457)