SI4410DYTRPBF International Rectifier, SI4410DYTRPBF Datasheet - Page 2

MOSFET N-CH 30V 10A 8-SOIC

SI4410DYTRPBF

Manufacturer Part Number
SI4410DYTRPBF
Description
MOSFET N-CH 30V 10A 8-SOIC
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of SI4410DYTRPBF

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
13.5 mOhm @ 10A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
10A
Vgs(th) (max) @ Id
1V @ 250µA
Gate Charge (qg) @ Vgs
45nC @ 10V
Input Capacitance (ciss) @ Vds
1585pF @ 15V
Power - Max
2.5W
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Configuration
Single Quad Drain Triple Source
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
20 mOhms
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
10 A
Power Dissipation
2.5 W
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Fall Time
44 ns
Gate Charge Qg
30 nC
Minimum Operating Temperature
- 55 C
Rise Time
7.7 ns
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
SI4410DYPBFTR
SI4410DYTRPBF
SI4410DYTRPBFTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SI4410DYTRPBF
Manufacturer:
International Rectifier
Quantity:
78 854
Part Number:
SI4410DYTRPBF
Manufacturer:
IR
Quantity:
20 000
Electrical Characteristics @ T
Source-Drain Ratings and Characteristics

ƒ
Notes:
V
∆V
V
g
I
Q
Q
Q
t
t
t
t
C
C
C
I
I
V
t
R
I
GSS
d(on)
r
d(off)
f
S
SM
rr
DSS
fs
(BR)DSS
GS(th)
SD
iss
oss
rss
g
gs
gd
DS(on)
2
Repetitive rating; pulse width limited by
Pulse width ≤ 300µs; duty cycle ≤
When mounted on FR4 Board, t ≤10 sec
(BR)DSS
max. junction temperature.
/∆T
J
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Gate Threshold Voltage
Forward Transconductance
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Continuous Source Current
(Diode Conduction)
Pulsed Source Current
(Body Diode) 
Diode Forward Voltage
Reverse Recovery Time
Static Drain-to-Source On-Resistance
Drain-to-Source Leakage Current
Parameter
Parameter
ƒ
J
= 25°C (unless otherwise specified)
R
I
Min. Typ. Max. Units
Starting T
T
Min. Typ. Max. Units
––– 0.029 –––
––– 0.010 0.0135
––– 0.015 0.020
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
––– 1585 –––
–––
–––
–––
–––
SD
1.0
30
G
J
≤ 150°C
= 25Ω, I
–––
–––
–––
–––
––– -100
–––
739
106
5.4
6.5
7.7
0.7
35
30
11
38
44
50
A, di/dt ≤ 130A/µs, V
J
= 25°C, L = 8.0mH
AS
–––
–––
–––
100
–––
–––
–––
–––
–––
–––
–––
–––
1.0
50
1.1
2.3
25
45
80
= 10A. (See Figure 15)
V/°C
nC
pF
ns
V
V
S
V
V
Reference to 25°C, I
V
V
V
V
V
V
V
V
I
V
V
V
I
R
R
V
V
ƒ = 1.0MHz, See Fig. 9
MOSFET symbol
integral reverse
p-n junction diode.
T
T
D
D
J
J
DD
GS
GS
GS
DS
DS
DS
DS
GS
GS
DS
GS
DD
G
D
GS
DS
= 10A
= 1.0A
= 25°C, I
= 25°C, I
= 6.0Ω
= 25Ω,
≤ V
= V
= 15V, I
= 30V, V
= 30V, V
= 15V
= 15V
= 0V, I
= 10V, I
= 4.5V, I
= -20V
= 20V
= 10V, See Fig. 10 ‚
= 25V
= 0V
(BR)DSS
GS
Conditions
showing the
, I
D
S
F
D
D
D
Conditions
D
= 250µA
GS
GS
= 2.3A, V
= 2.3A
= 250µA
= 10A
= 10A ‚
,
= 5.0A
= 0V
= 0V, T
D
www.irf.com
= 1mA
GS
J
= 55°C
= 0V ‚
G
S
D

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