STV160NF03LT4 STMicroelectronics, STV160NF03LT4 Datasheet - Page 2

MOSFET N-CH 30V 160A POWERSO-10

STV160NF03LT4

Manufacturer Part Number
STV160NF03LT4
Description
MOSFET N-CH 30V 160A POWERSO-10
Manufacturer
STMicroelectronics
Series
STripFET™r
Datasheet

Specifications of STV160NF03LT4

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
2.8 mOhm @ 80A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
160A
Vgs(th) (max) @ Id
1V @ 250µA
Gate Charge (qg) @ Vgs
140nC @ 10V
Input Capacitance (ciss) @ Vds
4700pF @ 25V
Power - Max
210W
Mounting Type
Surface Mount
Package / Case
PowerSO-10 Exposed Bottom Pad
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.0019 Ohms
Forward Transconductance Gfs (max / Min)
210 S
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
+/- 15 V
Continuous Drain Current
160 A
Power Dissipation
210 W
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 65 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-3252-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STV160NF03LT4
Manufacturer:
ST
0
Part Number:
STV160NF03LT4
Manufacturer:
ST
Quantity:
20 000
STV160NF03L
THERMAL DATA
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
ON (1)
DYNAMIC
2/9
Rthj-case
Rthj-amb
V
Symbol
Symbol
Symbol
R
V
(BR)DSS
g
I
I
C
C
I
DS(on)
C
C
GS(th)
D(on)
C
C
fs
DSS
GSS
R
L
L
T
oss
oss
iss
rss
iss
rss
S
D
(1)
g
l
Drain-source
Breakdown Voltage
Zero Gate Voltage
Drain Current (V
Gate-body Leakage
Current (V
Gate Threshold Voltage
Static Drain-source On
Resistance
On State Drain Current
Forward Transconductance
Gate resistance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Internal Source Inductance
Internal Drain Inductance
Thermal Resistance Junction-case Max
Thermal Resistance Junction-ambient Max
Maximum Lead Temperature For Soldering Purpose
Parameter
Parameter
Parameter
DS
= 0)
GS
= 0)
I
V
V
V
V
V
V
V
V
V
V
V
V
V
V
I
V
V
V
Package Body) to the Die
Center
From the Lead End (6mm from
D
D
DS
DS
GS
DS
GS
GS
GS
GS
GS
GS
GS
DS
GS
DS
DS
DS
DS
= 80 A
= 250 µA, V
= Max Rating
= Max Rating, T
= V
= 10 V, I
> I
> I
= 0 V, f = 1 MHz, V
= 25 V, f = 1 MHz, V
= 0 V, f = 1 MHz, V
= ± 15 V
= 10 V, I
= 10 V, I
= 8 V, I
= 5 V, I
= 8 V, I
= 5 V, I
= 10V
D(on)
D(on)
Test Conditions
Test Conditions
Test Conditions
GS
, I
D
D
D
D
x R
x R
D
D
D
D
=80 A; T
=40 A; T
= 80 A
= 40 A
=80 A;T
GS
= 250µA
= 80 A
= 45 A
DS(on)max,
DS(on)max,
= 0
C
j
j
j
= 125 °C
= 175 °C
= 175 °C
= 175 °C
GS
GS
GS
= 0
= 0
= 0
Not Available on Surface Mounting
Package
Min.
Min.
Min.
160
30
1
0.71
300
50
4700
1580
6500
9500
4000
Typ.
Typ.
1.86
Typ.
210
240
1.9
0.5
2
4
4
Max.
±100
Max.
Max.
12.8
2.8
2.8
3.8
6.7
6.4
7.8
10
1
°C/W
°C/W
°C
Unit
Unit
Unit
m
m
m
m
m
m
m
nH
µA
µA
nA
pF
pF
pF
pF
pF
pF
V
V
A
S

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