STW12NK95Z STMicroelectronics, STW12NK95Z Datasheet - Page 3

MOSFET N-CH 950V 10A TO-247

STW12NK95Z

Manufacturer Part Number
STW12NK95Z
Description
MOSFET N-CH 950V 10A TO-247
Manufacturer
STMicroelectronics
Series
SuperMESH™r
Datasheet

Specifications of STW12NK95Z

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
900 mOhm @ 5A, 10V
Drain To Source Voltage (vdss)
950V
Current - Continuous Drain (id) @ 25° C
10A
Vgs(th) (max) @ Id
4.5V @ 100µA
Gate Charge (qg) @ Vgs
113nC @ 10V
Input Capacitance (ciss) @ Vds
3500pF @ 25V
Power - Max
230W
Mounting Type
Through Hole
Package / Case
TO-247-3
Transistor Polarity
N Channel
Continuous Drain Current Id
10A
Drain Source Voltage Vds
950V
On Resistance Rds(on)
0.69ohm
Rds(on) Test Voltage Vgs
10V
Configuration
Single
Resistance Drain-source Rds (on)
0.69 Ohms
Forward Transconductance Gfs (max / Min)
12 S
Drain-source Breakdown Voltage
950 V
Gate-source Breakdown Voltage
30 V
Continuous Drain Current
10 A
Power Dissipation
230 W
Maximum Operating Temperature
+ 150 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-5167-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STW12NK95Z
Manufacturer:
ST
Quantity:
1 250
Part Number:
STW12NK95Z
Manufacturer:
ST
Quantity:
12 500
Part Number:
STW12NK95Z
Manufacturer:
ST
0
STW12NK95Z
1
Electrical ratings
Table 1.
1. Pulse width limited by safe operating area
2. I
Table 2.
Table 3.
Symbol
R
Symbol
V
R
Symbol
thj-case
ESD (G-S)
dv/dt
SD
E
I
V
I
thj-a
AR
P
T
DM
AS
V
V
T
DGR
l
T
I
I
TOT
≤ 10A, di/dt ≤ 200A/µs, V
DS
GS
stg
D
D
J
(1)
(2)
Thermal resistance junction-case Max
Thermal resistance junction-ambient Max
Maximum lead temperature for soldering
purpose
Avalanche current, repetitive or not-repetitive
(pulse width limited by Tj Max)
Single pulse avalanche energy
(starting Tj=25°C, Id=Iar, Vdd=50V)
Absolute maximum ratings
Thermal data
Avalanche characteristics
Drain-source voltage (V
Drain-gate voltage (R
Gate-source voltage
Drain current (continuous) at T
Drain current (continuous) at T
Drain current (pulsed)
Total dissipation at T
Derating Factor
Gate source ESD (HBM-C=100pF, R=1,5KΩ)
Peak diode recovery voltage slope
Operating junction temperature
Storage temperature
DD
Parameter
≤ V
(BR)DSS
Parameter
Parameter
C
GS
= 25°C
, T
GS
= 20KΩ)
j
≤ T
= 0)
JMAX
C
C
=100°C
= 25°C
Value
0.54
300
50
-55 to 150
Value
Value
6000
500
± 30
1.85
950
950
230
10
6.3
4.5
10
40
Electrical ratings
°C/W
°C/W
W/°C
Unit
Unit
Unit
V/ns
mJ
°C
°C
W
A
V
V
V
A
A
A
V
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