IRLR024TRPBF Vishay, IRLR024TRPBF Datasheet - Page 2

• Manufacturer Part Number: IRLR024TRPBF
• Description: MOSFET N-CH 60V 14A DPAK
• Manufacturer: Vishay

Specifications of IRLR024TRPBF

• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 100 mOhm @ 8.4A, 5V
• Drain To Source Voltage (vdss): 60V
• Current - Continuous Drain (id) @ 25° C: 14A
• Vgs(th) (max) @ Id: 2V @ 250µA
• Gate Charge (qg) @ Vgs: 18nC @ 5V
• Input Capacitance (ciss) @ Vds: 870pF @ 25V
• Power - Max: 2.5W
• Mounting Type: Surface Mount
• Package / Case: DPak, TO-252 (2 leads+tab), SC-63
• Transistor Polarity: N Channel
• Continuous Drain Current Id: 14A
• Drain Source Voltage Vds: 60V
• On Resistance Rds(on): 100mohm
• Rds(on) Test Voltage Vgs: 5V
• Leaded Process Compatible: Yes
• Configuration: Single
• Resistance Drain-source Rds (on): 0.1 Ohms
• Drain-source Breakdown Voltage: 60 V
• Gate-source Breakdown Voltage: +/- 10 V
• Continuous Drain Current: 14 A
• Power Dissipation: 2.5 W
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Fall Time: 41 ns
• Minimum Operating Temperature: - 55 C
• Rise Time: 110 ns
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: IRLR024PBFTR; IRLR024TRPBF; IRLR024TRPBFTR

IRLR024, IRLU024, SiHLR024, SiHLU024
Vishay Siliconix
Note
a. When mounted on 1" square PCB (FR-4 or G-10 material).
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width ≤ 300 µs; duty cycle ≤ 2 %.
www.vishay.com
2
Maximum Junction-to-Ambient
Maximum Junction-to-Ambient
(PCB Mount)
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Case (Drain)
SPECIFICATIONS T
PARAMETER
Static
Drain-Source Breakdown Voltage
V
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Drain Inductance
Internal Source Inductance
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulsed Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Forward Turn-On Time
DS
Temperature Coefficient
a
J
a
= 25 °C, unless otherwise noted
SYMBOL
SYMBOL
ΔV
R
V
t
t
I
I
C
R
V
C
V
R
R
GS(th)
DS(on)
C
Q
Q
d(on)
d(off)
I
GSS
DSS
Q
g
Q
L
t
DS
L
SM
I
t
t
on
DS
oss
t
SD
thJA
thJA
thJC
iss
rss
S
rr
gd
fs
gs
r
f
D
S
g
rr
/T
J
Between lead,
6 mm (0.25") from
package and center of
die contact
MOSFET symbol
showing the
integral reverse
p - n junction diode
V
V
V
T
GS
GS
GS
J
R
V
= 25 °C, I
T
G
Intrinsic turn-on time is negligible (turn-on is dominated by L
DS
= 5.0 V
= 4.0 V
= 5.0 V
Reference to 25 °C, I
J
= 9.0 Ω, R
MIN.
= 25 °C, I
= 48 V, V
-
-
-
V
V
V
V
f = 1.0 MHz, see fig. 5
V
TEST CONDITIONS
DS
DS
GS
DS
DD
c
= V
= 25 V, I
F
= 0 V, I
= 60 V, V
V
= 30 V, I
V
V
= 17 A, dI/dt = 100 A/µs
GS
DS
D
S
GS
GS
GS
I
= 14 A, V
D
= 1.7 Ω, see fig. 10
= ± 10 V
, I
= 25 V,
= 0 V, T
= 0 V,
see fig. 6 and 13
= 17 A, V
D
D
D
D
= 250 µA
= 250 µA
GS
I
I
= 8.4 A
D
D
= 17 A,
= 8.4 A
= 7.0 A
= 0 V
D
TYP.
GS
J
= 1 mA
-
-
-
= 125 °C
DS
G
G
= 0 V
b
= 48 V,
b
b
b
D
S
b
D
S
b
b
MIN.
1.0
7.3
MAX.
60
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
110
3.0
50
S-82993-Rev. B, 19-Jan-09
Document Number: 91322
0.068
TYP.
0.75
870
360
110
130
4.5
7.5
53
11
23
41
-
-
-
-
-
-
-
-
-
-
-
-
-
-
± 100
MAX.
0.10
0.14
S
250
260
2.0
4.5
1.5
1.5
25
18
12
14
56
-
-
-
-
-
-
-
-
-
-
-
-
and L
UNIT
°C/W
D
UNIT
)
V/°C
nA
µA
nC
nH
µC
pF
ns
ns
V
V
Ω
S
A
V