FDS3170N7 Fairchild Semiconductor, FDS3170N7 Datasheet

FDS3170N7

Manufacturer Part Number

FDS3170N7

Description

MOSFET N-CH 100V 6.7A 8-SOIC

Manufacturer

Fairchild Semiconductor

Series

PowerTrench®r

Datasheet

1.FDS3170N7.pdf (6 pages)

Specifications of FDS3170N7

Fet Type

MOSFET N-Channel, Metal Oxide

Fet Feature

Logic Level Gate

Rds On (max) @ Id, Vgs

26 mOhm @ 6.7A, 10V

Drain To Source Voltage (vdss)

100V

Current - Continuous Drain (id) @ 25° C

6.7A

Vgs(th) (max) @ Id

4V @ 250µA

Gate Charge (qg) @ Vgs

77nC @ 10V

Input Capacitance (ciss) @ Vds

2714pF @ 50V

Power - Max

Mounting Type

Surface Mount

Package / Case

8-SOIC (3.9mm Width) Exposed Pad, 8-eSOIC. 8-HSOIC

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

FDS3170N7TR
FDS3170N7_NL
FDS3170N7_NLTR
FDS3170N7_NLTR

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Meier Automation Equipment Co., Limited

Part Number:

FDS3170N7

Manufacturer:

FAIRCHILD/仙童

Quantity:

20 000

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

FDS3170N7-NL

Manufacturer:

FAIRCHILD

Quantity:

2 500

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This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

Updated process quality documentation, such as FMEAs and Control Plans, are available for

viewing upon request.

If you have any questions concerning this change, please contact:

PCN Originator:

Name: Ursal, Randy

E-mail: Randy.Ursal@notes.fairchildsemi.com

Phone:

Implementation of change:

Expected 1st Device Shipment Date: 2008/04/25

Earliest Year/Work Week of Changed Product: D0817

Change Type Description: Mold Compound

Description of Change (From): SOIC-8 FLMP, SSOT-6 FLMP and SC75-6L FLMP package

assembly in FSC approved manufacturing locations using non-Green mold compound as shown

in table 1:

Description of Change (To): SOIC-8 FLMP, SSOT-6 FLMP and SC75-6L FLMP package

assembly in FSC approved manufacturing locations using Green mold compound as shown in

table 2:

Reason for Change : Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is

dedicated to being a good corporate citizen. All Fairchild Semiconductor products are 2nd level

interconnect leadfree and RoHS compliance. The referenced material changes have been made

to provide a 'Full Green' (Halogen Free Flame Retardant) package. For additional details on the

corporate wide green initiative please visit our Web site at:

http://www.fairchildsemi.com/company/green/index.html. Manufacturing will occur at the same

assembly facilities producing the current non-green products. Package outline drawings of the

affected products remain unchanged. Green products will be fully compliant to all published

data sheet specifications and will be interchangeable with current non-green product. Quality

and reliability will remain at the highest standards already demonstrated with Fairchild's

existing products.

Qual/REL Plan Numbers : Q20070442

Qualification :

DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL

Technical Contact:

Name: Uy, Lester

E-mail: Lester.Uy@fairchildsemi.com

Phone: 63-32-3415636

Date Issued On : 2008/03/27

Date Created : 2008/03/12

PCN# : Q4075102-A

Pg. 1

Related parts for FDS3170N7

FDS3170N7 Summary of contents

Page 1

... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...

Page 2

The Qualification for FLMP Green EMC passed the Reliability Requirements as defined in iRel QP Q20070442. Change From Change To Pg. 2 ...

Page 3

Results/Discussion Test: (Autoclave) Lot Device Q20070442AAACLV FDS2170N7 Q20070442BAACLV FDC796N Q20070442CAACLV FDJ129P Q20070442DAACLV FDC6036P_F077 Q20070442EAACLV FDJ1027P Test: (High Temperature Gate Bias) Lot Device Q20070442AAHTGB FDS2170N7 Q20070442BAHTGB FDC796N Q20070442CAHTGB FDJ129P Q20070442DAHTGB FDC6036P_F077 Q20070442EAHTGB FDJ1027P Test: (High Temperature Reverse Bias) Lot Device Q20070442AAHTRB ...

Page 4

... Q20070442CAPCNL1A FDJ129P Q20070442DAPCNL1A FDC6036P_F077 Q20070442EAPCNL1A FDJ1027P Product Id Description : This final notification covers Fairchild Semiconductor SOIC-8 FLMP, SSOT-6 FLMP and SC75-6L FLMP packages. For a complete listing of products covered in this PCN release, please refer to the Affected FSID listing. Affected FSIDs : BAS6_BBA002B FDC6000NZ_F077 FDC6036P ...

Page 5

... FDJ1028N FDJ128N FDJ129P_F077 FDS2170N3 FDS3170N7_NL FDS4072N3 FDS4080N7 FDS6064N7 FDS7060N7 FDS7064SN3 FDS7066N7 FDS7082N3 FDS7088SN3 FDS7288N3 FDJ1032C FDJ128N_F077 FDS2070N3 FDS2170N7 FDS4070N3 FDS4072N7 FDS5170N7 FDS6162N3 FDS7064N FDS7066ASN3 FDS7079ZN3 FDS7088N3 FDS7088SN3_NL FDS7296N3 FDJ127P FDJ129P FDS2070N7 FDS3170N7 FDS4070N7 FDS4080N3 FDS6064N3 FDS6162N7 FDS7064N7 FDS7066N3 FDS7079ZN3_NL FDS7088N7 FDS7096N3 Pg. 5 ...

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