FDC658AP Fairchild Optoelectronics Group, FDC658AP Datasheet
FDC658AP
Manufacturer Part Number
FDC658AP
Description
MOSFET P-CH SGL LL 30V 4A SSOT6
Manufacturer
Fairchild Optoelectronics Group
Series
PowerTrench®r
Datasheet
1.FDC658AP.pdf
(5 pages)
Specifications of FDC658AP
Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
50 mOhm @ 4A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
4A
Vgs(th) (max) @ Id
3V @ 250µA
Gate Charge (qg) @ Vgs
8.1nC @ 5V
Input Capacitance (ciss) @ Vds
470pF @ 15V
Power - Max
800mW
Mounting Type
Surface Mount
Package / Case
SuperSOT-6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
FDC658APTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
FDC658AP
Manufacturer:
Fairchild Semiconductor
Quantity:
140 672
Part Number:
FDC658AP
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
Part Number:
FDC658AP-NL
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
Updated process quality documentation, such as FMEAs and Control Plans, are available for
viewing upon request.
If you have any questions concerning this change, please contact:
PCN Originator:
Name: Mendoza, Joseph
E-mail: Joseph.Mendoza@notes.fairchildsemi.com
Phone: 63-32-400534
Implementation of change:
Expected 1st Device Shipment Date: 2007/11/24
Earliest Year/Work Week of Changed Product: D0744
Change Type Description: Die Attach Method
Description of Change (From): TiNiAg Backmetal and eutectic die attach process
Description of Change (To): TiNiAg backmetal and skip cure adhesive die attach process
Reason for Change : Process and Device improvement
Qual/REL Plan Numbers : Q20070126
Qualification :
Adhesive Die Attach and TiNiAg backmetal Qualification builds for SSOT-6L pass
assembly level and reliability stress test requirements. Adhesive Die Attach process
and TiNiAg backmetal is recommended for use on SSOT-6L package.
Results/Discussion
Test: (Autoclave)
Lot
Q20070126AAACLV
Q20070126ABACLV
Q20070126ACACLV
Test: (Power Cycle)
Lot
Q20070126AAPRCL
DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL
Device
FDC6401N
Technical Contact:
Name: Mendoza, Joseph
E-mail: Joseph.Mendoza@notes.fairchildsemi.com
Phone: 63-32-400534
Device
FDC6401N
FDC6401N
FDC6401N
5000-CYCLES
0/77
96-HOURS
0/77
0/77
0/77
10000-CYCLES 15000-CYCLES Failure Code
0/77
Date Issued On : 2007/05/11
Date Created : 2007/03/30
Failure Code
PCN# : Q1071307
Pg. 1
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FDC658AP Summary of contents
Page 1
DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this ...
Page 2
... FDC6304P FDC6321C FDC634P_F073 FDC636P FDC638P_F073 FDC638P_NL FDC640P_F073 FDC640P_NL FDC642P_NB4N006 FDC654P FDC654P_NBGT007 FDC655BN FDC655BN_NL 0/77 0/77 0/77 1000 Failure Code 0/77 0/77 0/77 Failure Code Failure Code FDC6301N_NL FDC6303N FDC6320C FDC6321C_NL FDC634P_NF073 FDC636P_F073 FDC638P_NBAD009 FDC638P_SBAD006A FDC640P_NBAD004A FDC642P FDC642P_NF073 FDC654P_F073 FDC654P_NF073 FDC655BN_F073 FDC658AP Pg. 2 ...