PHP27NQ11T,127 NXP Semiconductors, PHP27NQ11T,127 Datasheet

MOSFET N-CH 110V 27.6A SOT78

PHP27NQ11T,127

Manufacturer Part Number
PHP27NQ11T,127
Description
MOSFET N-CH 110V 27.6A SOT78
Manufacturer
NXP Semiconductors
Series
TrenchMOS™r
Datasheet

Specifications of PHP27NQ11T,127

Package / Case
TO-220AB-3
Mounting Type
Through Hole
Power - Max
107W
Fet Type
MOSFET N-Channel, Metal Oxide
Gate Charge (qg) @ Vgs
30nC @ 10V
Vgs(th) (max) @ Id
4V @ 1mA
Current - Continuous Drain (id) @ 25° C
27.6A
Drain To Source Voltage (vdss)
110V
Fet Feature
Standard
Rds On (max) @ Id, Vgs
50 mOhm @ 14A, 10V
Minimum Operating Temperature
- 55 C
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.05 Ohm @ 10 V
Drain-source Breakdown Voltage
110 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
27.6 A
Power Dissipation
107000 mW
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
934058502127::PHP27NQ11T::PHP27NQ11T
1. Product profile
1.1 General description
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic
package using TrenchMOS technology. This product is designed and qualified for use in
computing, communications, consumer and industrial applications only.
Table 1.
Symbol Parameter
V
I
P
Dynamic characteristics
Q
Static characteristics
R
D
DS
tot
DSon
GD
Higher operating power due to low
thermal resistance
DC-to-DC convertors
PHP27NQ11T
N-channel TrenchMOS standard level FET
Rev. 02 — 4 March 2010
drain-source voltage
drain current
total power dissipation
gate-drain charge
drain-source on-state
resistance
Quick reference
Conditions
T
T
see
T
V
V
see
V
T
and
j
mb
mb
j
GS
DS
GS
≥ 25 °C; T
= 25 °C; see
= 25 °C; V
Figure 1
= 25 °C; see
Figure 11
= 80 V; T
10
= 10 V; I
= 10 V; I
j
D
D
and
≤ 175 °C
j
= 25 °C;
GS
= 27 A;
= 14 A;
Figure 9
Figure 2
3
= 10 V;
Low conduction losses due to low
on-state resistance
Switched-mode power supplies
Min
-
-
-
-
-
Product data sheet
Typ
-
-
-
12
40
Max
110
27.6
107
-
50
Unit
V
A
W
nC
mΩ

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PHP27NQ11T,127 Summary of contents

Page 1

PHP27NQ11T N-channel TrenchMOS standard level FET Rev. 02 — 4 March 2010 1. Product profile 1.1 General description Standard level N-channel enhancement mode Field-Effect Transistor (FET plastic package using TrenchMOS technology. This product is designed and qualified for ...

Page 2

... NXP Semiconductors 2. Pinning information Table 2. Pinning information Pin Symbol Description 1 G gate 2 D drain 3 S source mb D mounting base; connected to drain 3. Ordering information Table 3. Ordering information Type number Package Name PHP27NQ11T TO-220AB 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). ...

Page 3

... NXP Semiconductors 120 I der (%) 100 Fig 1. Normalized continuous drain current as a function of mounting base temperature Limit − Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage PHP27NQ11T_2 Product data sheet 03aa24 150 200 T (°C) mb Fig DSon ...

Page 4

... NXP Semiconductors 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter R thermal resistance from junction to th(j-mb) mounting base R thermal resistance from junction to th(j-a) ambient 10 Z th(j-mb) (K/W) 1 δ = 0.5 0.2 0.1 −1 10 0.05 0.02 −2 10 −6 10 Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration ...

Page 5

... NXP Semiconductors 6. Characteristics Table 6. Characteristics Symbol Parameter Static characteristics V drain-source breakdown (BR)DSS voltage V gate-source threshold voltage I GS(th) I drain leakage current DSS I gate leakage current GSS R drain-source on-state DSon resistance Dynamic characteristics Q total gate charge G(tot) Q gate-source charge GS Q gate-drain charge GD C input capacitance ...

Page 6

... NXP Semiconductors ( 0.5 1 Fig 5. Output characteristics: drain current as a function of drain-source voltage; typical values 5 V GS(th) (V) 4 max 3 typ 2 min 1 0 − Fig 7. Gate-source threshold voltage as a function of junction temperature PHP27NQ11T_2 Product data sheet 03ao62 ° ( 4 4.6 V 4 (V) DS Fig 6. ...

Page 7

... NXP Semiconductors 0.2 4.2 V 4 4.4 V DSon (Ω) 0.15 0.1 0. Fig 9. Drain-source on-state resistance as a function of drain current; typical values ° ( Fig 11. Gate-source voltage as a function of gate charge; typical values PHP27NQ11T_2 Product data sheet 03ao63 = 25 ° (A) D Fig 10. Normalized drain-source on-state resistance ...

Page 8

... NXP Semiconductors Fig 13. Source current as a function of source-drain voltage; typical values PHP27NQ11T_2 Product data sheet ( 175 ° 0.3 0.6 All information provided in this document is subject to legal disclaimers. Rev. 02 — 4 March 2010 PHP27NQ11T N-channel TrenchMOS standard level FET 03ao65 = 25 ° 0.9 1.2 ...

Page 9

... NXP Semiconductors 7. Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB D L DIMENSIONS (mm are the original dimensions) (2) UNIT 4.7 1.40 0.9 1.6 mm 4.1 1.25 0.6 1.0 Notes 1. Lead shoulder designs may vary. 2. Dimension includes excess dambar. OUTLINE VERSION IEC SOT78 Fig 14 ...

Page 10

... Document ID Release date PHP27NQ11T_2 20100304 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. PHP27NQ11T-01 20040517 (9397 750 13183) PHP27NQ11T_2 ...

Page 11

... NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. ...

Page 12

... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...

Page 13

... NXP Semiconductors 11. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 General description . . . . . . . . . . . . . . . . . . . . . .1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 4 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . .4 6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . .10 9 Legal information 9.1 Data sheet status ...

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