IRF6644 International Rectifier, IRF6644 Datasheet - Page 3
IRF6644
Manufacturer Part Number
IRF6644
Description
MOSFET N-CH 100V DIRECTFET-MN
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet
1.IRF6644.pdf
(10 pages)
Specifications of IRF6644
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
13 mOhm @ 10.3A, 10V
Drain To Source Voltage (vdss)
100V
Current - Continuous Drain (id) @ 25° C
10.3A
Vgs(th) (max) @ Id
4.8V @ 150µA
Gate Charge (qg) @ Vgs
47nC @ 10V
Input Capacitance (ciss) @ Vds
2210pF @ 25V
Power - Max
2.8W
Mounting Type
Surface Mount
Package / Case
DirectFET™ Isometric MN
Configuration
Single Quad Drain Dual Source
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
13 m Ohms
Drain-source Breakdown Voltage
100 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
10.3 A
Power Dissipation
2.8 W
Maximum Operating Temperature
+ 150 C
Mounting Style
Through Hole
Fall Time
16 ns
Minimum Operating Temperature
- 40 C
Rise Time
26 ns
Lead Free Status / Rohs Status
No
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
IRF6644MDF2
Manufacturer:
MOLEX
Quantity:
1 454
Part Number:
IRF6644MDF2
Manufacturer:
IR
Quantity:
20 000
Part Number:
IRF6644TR1
Manufacturer:
IR
Quantity:
20 000
Part Number:
IRF6644TR1PBF
Manufacturer:
IR
Quantity:
20 000
board (still air).
Notes:
P
P
P
T
T
T
R
R
R
R
R
Absolute Maximum Ratings
Thermal Resistance
Surface mounted on 1 in. square Cu
www.irf.com
P
J
STG
D
D
D
θJA
θJA
θJA
θJC
θJ-PCB
back and with small clip heatsink.
Surface mounted on 1 in. square Cu board, steady state.
Used double sided cooling , mounting pad.
Mounted on minimum footprint full size board with metalized
@T
@T
@T
A
A
C
= 25°C
= 70°C
= 25°C
0.0001
0.001
0.01
100
0.1
10
1
1E-006
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
D = 0.50
0.02
0.05
0.01
0.10
0.20
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
1E-005
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
fg
f
dg
eg
g
Parameter
Parameter
t 1 , Rectangular Pulse Duration (sec)
0.001
small clip heatsink (still air)
τ
J
τ
J
τ
1
Ci= τi/Ri
τ
1
Ci
0.01
T
R
i/Ri
C
θ
R
1
R
is measured at
measured with thermocouple incontact with top (Drain) of part.
1
τ
2
R
τ
2
2
R
2
0.1
with
R
τ
3
3
R
τ
3
3
J
Typ.
12.5
–––
–––
1.0
20
τ
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
R
4
τ
4
R
4
-40 to + 150
4
τ
1
C
τ
Max.
Ri (°C/W)
270
footprint full size board with
metalized back and with small
clip heatsink (still air)
2.8
1.8
89
Mounted on minimum
0.6784
17.299
17.566
9.4701
Max.
–––
–––
–––
1.4
10
45
106
0.00086
0.57756
8.94
τi (sec)
IRF6644
100
Units
Units
°C/W
°C
W
3