IRF6646 International Rectifier, IRF6646 Datasheet - Page 3

• Manufacturer Part Number: IRF6646
• Description: MOSFET N-CH 80V 12A DIRECTFET
• Manufacturer: International Rectifier
• Series: HEXFET®r

Specifications of IRF6646

• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Standard
• Rds On (max) @ Id, Vgs: 9.5 mOhm @ 12A, 10V
• Drain To Source Voltage (vdss): 80V
• Current - Continuous Drain (id) @ 25° C: 12A
• Vgs(th) (max) @ Id: 4.9V @ 150µA
• Gate Charge (qg) @ Vgs: 50nC @ 10V
• Input Capacitance (ciss) @ Vds: 2060pF @ 25V
• Power - Max: 2.8W
• Mounting Type: Surface Mount
• Package / Case: DirectFET™ Isometric MN
• Configuration: Single Quad Drain Dual Source
• Transistor Polarity: N-Channel
• Resistance Drain-source Rds (on): 9.5 mOhms
• Drain-source Breakdown Voltage: 80 V
• Gate-source Breakdown Voltage: +/- 20 V
• Continuous Drain Current: 12 A
• Power Dissipation: 2.8 W
• Maximum Operating Temperature: + 150 C
• Mounting Style: Through Hole
• Fall Time: 12 ns
• Minimum Operating Temperature: - 40 C
• Rise Time: 20 ns
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant


‚
ƒ
board (still air).
Notes:
P
P
P
T
T
T
R
R
R
R
R
Absolute Maximum Ratings
Thermal Resistance
 Surface mounted on 1 in. square Cu
www.irf.com
P
J
STG
D
D
D
θJA
θJA
θJA
θJC
θJ-PCB
back and with small clip heatsink.
Surface mounted on 1 in. square Cu board, steady state.
Used double sided cooling , mounting pad.
Mounted on minimum footprint full size board with metalized
@T
@T
@T
A
A
C
= 25°C
= 70°C
= 25°C
0.001
0.01
100
0.1
10
1
1E-006
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 
D = 0.50
0.20
0.05
0.10
0.02
0.01
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
1E-005
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
fg
f
dg
eg
g
Parameter
Parameter
t 1 , Rectangular Pulse Duration (sec)
0.001
small clip heatsink (still air)
ƒ
τ
J
τ
J
τ
1
Ci= τi/Ri
τ
1
„
…
Ci= τi/Ri
T
R
0.01
C
R
θ
1
R
is measured at
measured with thermocouple incontact with top (Drain) of part.
1
τ
2
R
τ
2
2
R
2
with
0.1
R
τ
3
3
R
τ
3
3
J
Typ.
12.5
–––
–––
1.0
20
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
τ
R
4
τ
4
-40 to + 150
R
4
4
1
τ
Max.
A
footprint full size board with
metalized back and with small
clip heatsink (still air)
270
τ
2.8
1.8
ƒ Mounted on minimum
89
Ri (°C/W)
0.678449 0.00086
17.29903 0.57756
17.56647
9.470128
Max.
–––
–––
–––
1.4
45
10
8.94
106
τi (sec)
IRF6646
100
Units
Units
°C/W
°C
W
3