NTD2955G ON Semiconductor, NTD2955G Datasheet - Page 8

MOSFET P-CH 60V 12A DPAK

NTD2955G

Manufacturer Part Number
NTD2955G
Description
MOSFET P-CH 60V 12A DPAK
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTD2955G

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
180 mOhm @ 6A, 10V
Drain To Source Voltage (vdss)
60V
Current - Continuous Drain (id) @ 25° C
12A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
30nC @ 10V
Input Capacitance (ciss) @ Vds
750pF @ 25V
Power - Max
55W
Mounting Type
Surface Mount
Package / Case
DPak, TO-252 (2 leads+tab), SC-63
Configuration
Single
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
0.18 Ohm @ 10 V
Forward Transconductance Gfs (max / Min)
8 S
Drain-source Breakdown Voltage
60 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
12 A
Power Dissipation
55000 mW
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
NTD2955G
NTD2955GOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTD2955G
Manufacturer:
ON
Quantity:
12 500
Part Number:
NTD2955G
Manufacturer:
ON SEMICONDUCTOR
Quantity:
30 000
Part Number:
NTD2955G
Manufacturer:
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Quantity:
12 500
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
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SEATING
PLANE
-T-
V
S
F
1
G
B
R
4
2
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
3
A
K
D
0.13 (0.005)
3 PL
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.228
5.80
J
M
T
C
N. American Technical Support: 800-282-9855 Toll Free
 USA/Canada
Europe, Middle East and Africa Technical Support:
 Phone: 421 33 790 2910
Japan Customer Focus Center
 Phone: 81-3-5773-3850
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
NTD2955, NTD2955P
0.244
0.101
6.20
2.58
E
H
http://onsemi.com
CASE 369D-01
ISSUE B
DPAK-3
8
0.118
3.0
0.063
1.6
SCALE 3:1
Z
6.172
0.243
inches
NOTES:
mm
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
ANSI Y14.5M, 1982.
STYLE 2:
DIM
PIN 1. GATE
A
B
C
D
E
G
H
K
R
S
V
F
J
Z
2. DRAIN
3. SOURCE
4. DRAIN
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
0.235
0.250
0.086
0.027
0.018
0.037
0.034
0.018
0.350
0.180
0.025
0.035
0.155
MIN
0.090 BSC
INCHES
0.245
0.265
0.094
0.035
0.023
0.045
0.040
0.023
0.380
0.215
0.040
0.050
MAX
---
MILLIMETERS
5.97
6.35
2.19
0.69
0.46
0.94
0.87
0.46
8.89
4.45
0.63
0.89
3.93
MIN
2.29 BSC
MAX
6.35
6.73
2.38
0.88
0.58
1.14
1.01
0.58
9.65
5.45
1.01
1.27
---
NTD2955/D

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