SPP21N50C3 Infineon Technologies, SPP21N50C3 Datasheet - Page 3

MOSFET N-CH 560V 21A TO-220AB

SPP21N50C3

Manufacturer Part Number
SPP21N50C3
Description
MOSFET N-CH 560V 21A TO-220AB
Manufacturer
Infineon Technologies
Series
CoolMOS™r
Datasheet

Specifications of SPP21N50C3

Package / Case
TO-220AB
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
190 mOhm @ 13.1A, 10V
Drain To Source Voltage (vdss)
560V
Current - Continuous Drain (id) @ 25° C
21A
Vgs(th) (max) @ Id
3.9V @ 1mA
Gate Charge (qg) @ Vgs
95nC @ 10V
Input Capacitance (ciss) @ Vds
2400pF @ 25V
Power - Max
208W
Mounting Type
Through Hole
Minimum Operating Temperature
- 55 C
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.19 Ohm @ 10 V
Drain-source Breakdown Voltage
500 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
21 A
Power Dissipation
208000 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
Through Hole
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
SP000013832
SPP21N50C3IN
SPP21N50C3X
SPP21N50C3XK
SPP21N50C3XTIN
SPP21N50C3XTIN

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SPP21N50C3
Manufacturer:
INFINEON
Quantity:
5 000
Part Number:
SPP21N50C3
Manufacturer:
Infineon
Quantity:
500
Part Number:
SPP21N50C3
Manufacturer:
ST
0
Part Number:
SPP21N50C3
Manufacturer:
INFINEON/英飞凌
Quantity:
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Part Number:
SPP21N50C3
Quantity:
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Rev. 3.2
Electrical Characteristics
Parameter
Transconductance
Input capacitance
Output capacitance
Reverse transfer capacitance
Effective output capacitance,
energy related
Effective output capacitance,
time related
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Gate Charge Characteristics
Gate to source charge
Gate to drain charge
Gate charge total
Gate plateau voltage
1 Limited only by maximum temperature
2 Repetitve avalanche causes additional power losses that can be calculated as P
3 Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
4 Soldering temperature for TO-263: 220°C, reflow
5 C
6 C
7 I
Identical low-side and high-side switch.
SD
o(er)
o(tr)
<=I
is a fixed capacitance that gives the same charging time as C
is a fixed capacitance that gives the same stored energy as C
D
, di/dt<=200A/us, V
DClink
=400V, V
5)
6)
Symbol
g
C
C
C
C
C
t
t
t
t
Q
Q
Q
V
d(on)
r
d(off)
f
fs
(plateau)
iss
oss
rss
o(er)
o(tr)
gs
gd
g
peak
<V
page 3
BR, DSS
V
I
V
f=1MHz
V
V
I
R
V
V
V
V
D
D
DS
GS
GS
DD
G
DD
DD
GS
DD
=13.1A
=21A,
=3.6Ω
≥2*I
=0V, V
=0V, V
=380V, V
=380V, I
=380V, I
=0 to 10V
=380V, I
Conditions
, T
D
j
*R
<T
DS
DS
DS(on)max
j,max.
D
D
D
GS
=25V,
=400V
=21A
=21A,
=21A
=0/10V,
oss
oss
SPI21N50C3, SPA21N50C3
while V
while V
,
min.
DS
DS
-
-
-
-
-
-
-
-
-
-
-
-
-
-
AV
is rising from 0 to 80% V
is rising from 0 to 80% V
=E
Values
AR
2400
1200
typ.
181
4.5
18
30
87
10
67
10
50
95
*f.
5
5
SPP21N50C3
2009-12-22
max.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Unit
S
pF
ns
nC
V
DSS
DSS
.
.

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