IRF624S Vishay, IRF624S Datasheet - Page 2

MOSFET N-CH 250V 4.4A D2PAK

IRF624S

Manufacturer Part Number
IRF624S
Description
MOSFET N-CH 250V 4.4A D2PAK
Manufacturer
Vishay
Datasheet

Specifications of IRF624S

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
1.1 Ohm @ 2.6A, 10V
Drain To Source Voltage (vdss)
250V
Current - Continuous Drain (id) @ 25° C
4.4A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
14nC @ 10V
Input Capacitance (ciss) @ Vds
260pF @ 25V
Power - Max
3.1W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRF624S

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
IRF624SPBF
Quantity:
13 900
IRF624S, SiHF624S
Vishay Siliconix
Note
a. When mounted on 1" square PCB (FR-4 or G-10 material).
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width ≤ 300 µs; duty cycle ≤ 2 %.
www.vishay.com
2
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient
(PCB Mount)
Maximum Junction-to-Ambient
Maximum Junction-to-Case (Drain)
SPECIFICATIONS T
PARAMETER
Static
Drain-Source Breakdown Voltage
V
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Drain Inductance
Internal Source Inductance
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulsed Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Forward Turn-On Time
DS
Temperature Coefficient
a
J
a
= 25 °C, unless otherwise noted
SYMBOL
SYMBOL
ΔV
R
V
R
R
R
t
t
I
I
C
V
DS(on)
C
V
GS(th)
C
Q
Q
d(on)
d(off)
I
GSS
DSS
Q
Q
g
L
L
t
DS
I
SM
t
thJA
thJA
thJC
t
t
on
DS
oss
SD
iss
rss
S
rr
fs
gs
gd
r
f
D
S
rr
g
/T
J
Between lead,
6 mm (0.25") from
package and center of
die contact
MOSFET symbol
showing the
integral reverse
p - n junction diode
V
V
V
GS
GS
Intrinsic turn-on time is negligible (turn-on is dominated by L
T
DS
Reference to 25 °C, I
J
MIN.
= 10 V
= 10 V
= 25 °C, I
= 200V, V
-
-
-
V
V
V
V
V
f = 1.0 MHz, see fig. 5
T
TEST CONDITIONS
R
DS
DS
DD
GS
DS
J
G
dI/dt = 100 A/µs
= 25 °C, I
= 250 V, V
= V
= 125 V, I
= 18 Ω, R
= 50 V, I
= 0 V, I
V
V
see fig. 10
V
GS
S
DS
GS
GS
I
GS
D
= 4.4 A, V
= ± 20 V
= 25 V,
, I
= 4.4 A, V
= 0 V,
see fig. 6 and 13
= 0 V, T
D
D
D
F
= 250 µA
= 250 µA
D
D
I
= 4.4 A,
= 2.6 A
GS
D
= 28 Ω
= 4.4 A
b
TYP.
= 2.6 A
D
= 0 V
-
-
-
= 1 mA
GS
b
J
G
G
DS
= 125 °C
= 0 V
b
= 200 V
b
D
S
b
b
D
S
MIN.
250
MAX.
2.0
1.5
2.5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
40
62
S09-0071-Rev. A, 02-Feb-09
Document Number: 91030
TYP.
0.36
0.93
260
200
7.0
4.5
7.5
77
15
13
20
12
-
-
-
-
-
-
-
-
-
-
-
-
-
MAX.
± 100
250
400
S
4.0
1.1
2.7
7.8
4.4
1.8
1.9
25
14
14
-
-
-
-
-
-
-
-
-
-
-
-
and L
UNIT
°C/W
D
UNIT
V/°C
)
nC
nH
µC
nA
µA
pF
ns
ns
Ω
V
V
S
A
V

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