IRFBF30STRR Vishay, IRFBF30STRR Datasheet

MOSFET N-CH 900V 3.6A D2PAK

IRFBF30STRR

Manufacturer Part Number
IRFBF30STRR
Description
MOSFET N-CH 900V 3.6A D2PAK
Manufacturer
Vishay
Datasheet

Specifications of IRFBF30STRR

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
3.7 Ohm @ 2.2A, 10V
Drain To Source Voltage (vdss)
900V
Current - Continuous Drain (id) @ 25° C
3.6A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
78nC @ 10V
Input Capacitance (ciss) @ Vds
1200pF @ 25V
Power - Max
125W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
c. I
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91389
S10-2433-Rev. B, 25-Oct-10
PRODUCT SUMMARY
V
R
Q
Q
Q
Configuration
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
SnPb
ABSOLUTE MAXIMUM RATINGS (T
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Linear Derating Factor
Single Pulse Avalanche Energy
Repetitive Avalanche Current
Repetitive Avalanche Energy
Maximum Power Dissipation
Peak Diode Recovery dV/dt
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
DS
DS(on)
g
gs
gd
SD
DD
(Max.) (nC)
(nC)
(V)
(nC)
G D
 3.6 A, dI/dt  70 A/μs, V
= 50 V, starting T
()
D
S
2
PAK (TO-263)
a
J
= 25 °C, L = 36 mH, R
c
a
a
DD
b
V
 600, T
GS
= 10 V
G
J
Single
 150 °C.
N-Channel MOSFET
900
78
10
42
g
= 25 , I
C
= 25 °C, unless otherwise noted)
Power MOSFET
D
S
V
3.7
GS
AS
at 10 V
= 3.6 A (see fig. 12).
T
for 10 s
C
= 25 °C
T
T
C
C
D
SiHFBF30S-GE3
IRFBF30SPbF
SiHFBF30S-E3
IRFBF30S
SiHFBF30S
= 100 °C
= 25 °C
2
FEATURES
• Halogen-free According to IEC 61249-2-21
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• Fast Switching
• Ease of Paralleling
• Simple Drive Requirements
• Compliant to RoHS Directive 2002/95/EC
DESCRIPTION
Third generation MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized
cost-effectiveness.
The D
commercial-industrial applications at power dissipation
levels to approximately 50 W. The low thermal resistance
and low package cost of the D
its wide acceptance throughout the industry.
PAK (TO-263)
Definition
2
PAK (TO-263) package is universially preferred for all
SYMBOL
T
dV/dt
J
V
V
E
E
I
I
, T
P
device
DM
I
AR
GS
DS
AS
AR
D
D
stg
IRFBF30S, SiHFBF30S
design,
- 55 to + 150
2
LIMIT
300
PAK (TO-263) contribute to
± 20
900
250
125
3.6
2.3
1.0
3.6
1.5
14
13
low
Vishay Siliconix
d
on-resistance
www.vishay.com
UNIT
W/°C
V/ns
mJ
mJ
°C
W
V
A
A
and
1

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IRFBF30STRR Summary of contents

Page 1

... Ease of Paralleling 42 • Simple Drive Requirements Single • Compliant to RoHS Directive 2002/95/EC D DESCRIPTION Third generation MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized G cost-effectiveness. 2 The D PAK (TO-263) package is universially preferred for all commercial-industrial applications at power dissipation levels to approximately 50 W ...

Page 2

... IRFBF30S, SiHFBF30S Vishay Siliconix THERMAL RESISTANCE RATINGS PARAMETER Maximum Junction-to-Ambient Maximum Junction-to-Ambient (PCB Mount) Maximum Junction-to-Case (Drain) Note a. When mounted on 1" square PCB (FR-4 or G-10 material). SPECIFICATIONS ( °C, unless otherwise noted) J PARAMETER Static Drain-Source Breakdown Voltage V Temperature Coefficient DS Gate-Source Threshold Voltage ...

Page 3

... TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) Fig Typical Output Characteristics, T Fig. 2 -Typical Output Characteristics, T Document Number: 91389 S10-2433-Rev. B, 25-Oct-10 IRFBF30S, SiHFBF30S = 25 °C Fig Typical Transfer Characteristics C = 150 °C Fig Normalized On-Resistance vs. Temperature C Vishay Siliconix www.vishay.com 3 ...

Page 4

... IRFBF30S, SiHFBF30S Vishay Siliconix Fig Typical Capacitance vs. Drain-to-Source Voltage Fig Typical Gate Charge vs. Gate-to-Source Voltage www.vishay.com 4 Fig Typical Source-Drain Diode Forward Voltage Fig Maximum Safe Operating Area Document Number: 91389 S10-2433-Rev. B, 25-Oct-10 ...

Page 5

... Fig. 12a - Unclamped Inductive Test Circuit Document Number: 91389 S10-2433-Rev. B, 25-Oct-10 IRFBF30S, SiHFBF30S Pulse width ≤ 1 µs Duty factor ≤ 0.1 % Fig. 10a - Switching Time Test Circuit Fig. 10b - Switching Time Waveforms + Fig. 12b - Unclamped Inductive Waveforms Vishay Siliconix D.U. d(on) r d(off www.vishay.com 5 ...

Page 6

... IRFBF30S, SiHFBF30S Vishay Siliconix Charge Fig. 13a - Basic Gate Charge Waveform www.vishay.com 6 Fig. 12c - Maximum Avalanche Energy vs. Drain Current Current regulator Same type as D.U.T. 50 kΩ 0.2 µF 0.3 µ D.U. Current sampling resistors Fig. 13b - Gate Charge Test Circuit Document Number: 91389 ...

Page 7

... Note Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91389. Document Number: 91389 S10-2433-Rev ...

Page 8

... Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part ...

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