FDD2612 Fairchild Semiconductor, FDD2612 Datasheet

MOSFET N-CH 200V 4.9A D-PAK

FDD2612

Manufacturer Part Number
FDD2612
Description
MOSFET N-CH 200V 4.9A D-PAK
Manufacturer
Fairchild Semiconductor
Series
PowerTrench®r
Datasheet

Specifications of FDD2612

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
720 mOhm @ 1.5A, 10V
Drain To Source Voltage (vdss)
200V
Current - Continuous Drain (id) @ 25° C
4.9A
Vgs(th) (max) @ Id
4.5V @ 250µA
Gate Charge (qg) @ Vgs
11nC @ 10V
Input Capacitance (ciss) @ Vds
234pF @ 100V
Power - Max
1.6W
Mounting Type
Surface Mount
Package / Case
DPak, TO-252 (2 leads+tab), SC-63
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.72 Ohms
Forward Transconductance Gfs (max / Min)
4.4 S
Drain-source Breakdown Voltage
200 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
4.9 A
Power Dissipation
42 W
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
FDD2612
200V N-Channel PowerTrench MOSFET
General Description
This
specifically to improve the overall efficiency of DC/DC
converters using either synchronous or conventional
switching PWM controllers. It has been optimized for
low gate charge, low R
Applications
2001 Fairchild Semiconductor Corporation
Absolute Maximum Ratings
Symbol
V
V
I
P
T
Thermal Characteristics
R
R
R
Package Marking and Ordering Information
D
DC/DC converter
J
DSS
GSS
D
, T
JC
JA
JA
Device Marking
STG
N-Channel
FDD2612
Drain-Source Voltage
Gate-Source Voltage
Drain Current
Power Dissipation
Operating and Storage Junction Temperature Range
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Ambient
G
S
MOSFET
DS(ON)
TO-252
and fast switching speed.
– Continuous
– Pulsed
has
FDD2612
Device
Parameter
D
been
designed
T
A
=25
o
C unless otherwise noted
Reel Size
13’’
(Note 1a)
(Note 1b)
(Note 1a)
(Note 1b)
(Note 1a)
(Note 1)
(Note 1)
Features
4.9 A, 200 V.
High performance trench technology for extremely
low R
High power and current handling capability
Fast switching speed
Low gate charge (8nC typical)
DS(ON)
Tape width
G
16mm
R
Ratings
55 to +175
DS(ON)
200
4.9
3.8
1.6
3.5
10
42
40
96
20
= 720 m @ V
S
D
August 2001
FDD2612 Rev B1 (W)
GS
2500 units
Quantity
= 10 V
Units
C/W
C/W
C/W
W
V
V
A
C

Related parts for FDD2612

FDD2612 Summary of contents

Page 1

... Low gate charge (8nC typical =25 C unless otherwise noted A (Note 1a) (Note 1) (Note 1a) (Note 1b) (Note 1) (Note 1a) (Note 1b) Reel Size 13’’ August 2001 R = 720 DS(ON Ratings Units 200 4 3.8 1 +175 C 3.5 C/W 40 C/W 96 C/W Tape width Quantity 16mm 2500 units FDD2612 Rev B1 (W) ...

Page 2

... V = 10V. Package current limitation is 21A DS(on) J(max) GS Min Typ Max Units = 1. 1.5 A 200 V 246 mV 100 nA –100 4.5 V – 8.6 mV/ C 600 720 m 1125 1422 5 A 4.4 S 234 1.6 nC 2.2 nC 3.2 A 0.8 1 96°C/W when mounted minimum pad. FDD2612 Rev B1(W) ...

Page 3

... C 0.0001 Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature 5.5V GS 6.0V 6.5V 7.5V 10V DRAIN CURRENT ( 0. 125 GATE TO SOURCE VOLTAGE (V) GS Gate-to-Source Voltage 125 -55 C 0.2 0.4 0.6 0 BODY DIODE FORWARD VOLTAGE (V) SD FDD2612 Rev B1( 1.2 ...

Page 4

... Figure 10. Single Pulse Maximum 0.01 0 1MHz ISS 40 80 120 160 200 V , DRAIN TO SOURCE VOLTAGE (V) DS SINGLE PULSE R =96°C 25° 100 1000 t , TIME (sec) 1 Power Dissipation. R ( °C/W JA P(pk ( Duty Cycle 100 1000 FDD2612 Rev B1(W) ...

Page 5

... TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended exhaustive list of all such trademarks. ACEx™ FAST Bottomless™ FASTr™ FRFET™ CoolFET™ GlobalOptoisolator™ CROSSVOLT™ GTO™ DenseTrench™ ...

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