BUK9506-55A,127 NXP Semiconductors, BUK9506-55A,127 Datasheet - Page 4

• Manufacturer Part Number: BUK9506-55A,127
• Description: MOSFET N-CH 55V 75A SOT78
• Manufacturer: NXP Semiconductors
• Series: TrenchMOS™r

Specifications of BUK9506-55A,127

• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 5.8 mOhm @ 25A, 10V
• Drain To Source Voltage (vdss): 55V
• Current - Continuous Drain (id) @ 25° C: 75A
• Vgs(th) (max) @ Id: 2V @ 1mA
• Input Capacitance (ciss) @ Vds: 8600pF @ 25V
• Power - Max: 300W
• Mounting Type: Through Hole
• Package / Case: TO-220AB-3
• Configuration: Single
• Transistor Polarity: N-Channel
• Resistance Drain-source Rds (on): 0.0058 Ohms
• Drain-source Breakdown Voltage: 55 V
• Gate-source Breakdown Voltage: +/- 15 V
• Continuous Drain Current: 154 A
• Power Dissipation: 300 W
• Maximum Operating Temperature: + 175 C
• Mounting Style: Through Hole
• Fall Time: 235 ns
• Minimum Operating Temperature: - 55 C
• Rise Time: 180 ns
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Gate Charge (qg) @ Vgs: -
• Lead Free Status / Rohs Status: Details
• Other names: 934055408127; BUK9506-55A; BUK9506-55A

7. Thermal characteristics
Table 4:
Philips Semiconductors
9397 750 08416
Product data
Symbol
R
R
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration.
th(j-a)
th(j-mb)
Thermal characteristics
Z th(j-mb)
Parameter
thermal resistance from junction to ambient
thermal resistance from junction to mounting
base
(K/W)
10 -1
10 -2
10 -3
1
10 -6
0.2
0.1
0.05
0.02
= 0.5
Single Shot
7.1 Transient thermal impedance
10 -5
10 -4
Rev. 03 — 23 July 2001
BUK9506-55A; BUK9606-55A;
Conditions
vertical in still air; SOT78 and
SOT226 packages
mounted on printed circuit board;
minimum footprint; SOT404
package
Figure 4
10 -3
10 -2
10 -1
P
BUK9E06-55A
t p
© Philips Electronics N.V. 2001. All rights reserved.
T
t p (s)
=
Value
60
50
0.5
03nf03
t p
T
t
1
Unit
K/W
K/W
K/W
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