SSM2166SZ Analog Devices Inc, SSM2166SZ Datasheet - Page 2

• Manufacturer Part Number: SSM2166SZ
• Description: Audio Amp Microphone 1-CH Mono Class-AB 14-Pin SOIC N
• Manufacturer: Analog Devices Inc

Specifications of SSM2166SZ

• Package: 14SOIC N
• Function: Microphone
• Amplifier Type: Class-AB
• Typical Voltage Gain: 60 dB
• Total Harmonic Distortion Noise: 0.25@100000Ohm %
• Typical Psrr: 50 dB
• Typical Gain Bandwidth Product: 30 MHz
• Maximum Load Resistance: 100000 Ohm
• Output Type: 1-Channel Mono
• Voltage - Supply: 4.5 V ~ 5.5 V
• Features: Microphone
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Bandwidth: 20 kHz
• Current, Supply: 7.5 mA
• Harmonic Distortion: 0.25 %
• Impedance, Thermal: 120 °C/W
• Package Type: SOIC-14
• Temperature, Operating, Range: -40 to +85 °C
• Voltage, Input: 1 V
• Voltage, Noise: 17 nV/sqrt Hz
• Voltage, Supply: 4.5 to 5.5 V
• No. Of Channels: 1
• Supply Voltage Range: 4.5V To 5.5V
• Load Impedance: 75ohm
• Operating Temperature Range: -40°C To +85°C
• Amplifier Case Style: SOIC
• No. Of Pins: 14
• Msl: MSL 1 - Unlimited
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Max Output Power X Channels @ Load: -
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

SSM2166
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram and Typical Speech Application ...... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 4
Pin Configuration and Function Descriptions ............................. 5
Typical Performance Characteristics ............................................. 6
Theory of Operation ........................................................................ 8
REVISION HISTORY
7/08—Rev. C to Rev. D
Changes to Figure 4 through Figure 9 ........................................... 6
Changes to Figure 11 and Figure 12 ............................................... 7
Changes to Figure 19 ...................................................................... 10
Changes to Figure 26 ...................................................................... 13
Added Top Branding Revision Reflecting Die Replacement
Table ................................................................................................. 17
5/08—Rev. B to Rev. C
Updated Format .................................................................. Universal
Changes to Features Section and General Description
Section ................................................................................................ 1
Changes to Table 1 ............................................................................ 3
Changes to Table 2 ............................................................................ 4
Deleted TPC 3; Renumbered Sequentially .................................... 4
Changes to Table 4, Pin 8 Description Column ........................... 5
Changes to Figure 5, Figure 6, Figure 8, and Figure 9 ................. 6
Change to Figure 11 ......................................................................... 7
Changes to Signal Path Section ...................................................... 9
Thermal Resistance ...................................................................... 4
ESD Caution .................................................................................. 4
Applications Information ............................................................ 8
Rev. D | Page 2 of 20
Evaluation Board ............................................................................ 13
Outline Dimensions ....................................................................... 17
Added Figure 19 ............................................................................. 10
Deleted Figure 14 and Figure 17 .................................................. 12
Deleted Other Versions Section ................................................... 13
Changes to Figure 26 ...................................................................... 13
Changes to Figure 27 ...................................................................... 14
Changes to Test Equipment Section ............................................ 15
Added Table 6 ................................................................................. 16
Added Table 7 ................................................................................. 16
Updated Outline Dimensions ....................................................... 17
Changes to Ordering Guide .......................................................... 17
3/03—Rev. A to Rev. B
Deleted PDIP Package ....................................................... Universal
Change to General Description ....................................................... 1
Changes to Thermal Characteristics ............................................... 2
Changes to Ordering Guide ............................................................. 2
Deleted 14-Lead PDIP, Outline Dimensions .............................. 15
Updated 14-Lead Narrow-Body SOIC, Outline Dimensions ... 15
Signal Path ......................................................................................8
Level Detector ................................................................................9
Control Circuitry ........................................................................ 10
Power-Down Feature ................................................................. 12
PCB Layout Considerations ...................................................... 12
Evaluation Board Examples ...................................................... 14
Evaluation Board Setup Procedure .......................................... 15
Test Equipment Setup ................................................................ 15
Setup Summary .......................................................................... 16
Ordering Guide .......................................................................... 17