ADG711BR Analog Devices Inc, ADG711BR Datasheet - Page 4

• Manufacturer Part Number: ADG711BR
• Description: Analog Switch Quad SPST 16-Pin SOIC N
• Manufacturer: Analog Devices Inc
• Type: Analog Switchr

Specifications of ADG711BR

• Package: 16SOIC N
• Maximum On Resistance: 8@3V Ohm
• Maximum High Level Output Current: 30 mA
• Maximum Turn-off Time: 7(Typ)@3V ns
• Maximum Turn-on Time: 13(Typ)@3V ns
• Switch Architecture: SPST
• Power Supply Type: Single
• Rohs Status: RoHS non-compliant
• Function: Switch
• Circuit: 4 x SPST - NO
• On-state Resistance: 4 Ohm
• Voltage Supply Source: Single Supply
• Voltage - Supply, Single/dual (±): 1.8 V ~ 5.5 V
• Current - Supply: 0.001µA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Multiplexer Configuration: Quad SPST
• Number Of Inputs: 4
• Number Of Outputs: 4
• Number Of Channels: 4
• Analog Switch On Resistance: 5@3VOhm
• Analog Switch Turn On Time: 13ns
• Analog Switch Turn Off Time: 7ns
• Package Type: SOIC N
• Power Supply Requirement: Single
• Single Supply Voltage (min): 1.8V
• Single Supply Voltage (typ): 3/5V
• Single Supply Voltage (max): 5.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Power Dissipation: 520mW
• Supply Current: 0.001mA
• Mounting: Surface Mount
• Pin Count: 16
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Not Compliant

ADG711/ADG712/ADG713
Model
ADG711BR
ADG711BR-REEL
ADG711BR-REEL7
ADG711BRU
ADG711BRU-REEL
ADG711BRU-REEL7
ADG712BR
ADG712BR-REEL
ADG712BR-REEL7
ADG712BRU
ADG712BRU-REEL
ADG712BRU-REEL7
ADG712BRUZ*
ADG712BRUZ-REEL*
ADG712BRUZ-REEL7*
ADG713BR
ADG713BR-REEL
ADG713BR-REEL7
ADG713BRU
ADG713BRU-REEL
ADG713BRU-REEL7
*Z = Pb-free part.
ABSOLUTE MAXIMUM RATINGS
(T
V
Analog, Digital Inputs
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
TSSOP Package, Power Dissipation . . . . . . . . . . . . . 430 mW
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG711/ADG712/ADG713 feature proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
DD
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C
θ
θ
A
JA
JC
= +25°C unless otherwise noted)
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +6 V
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 150°C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 27°C/W
2
(Pulsed at 1 ms, 10% Duty Cycle max)
. . . . . . . . . . . –0.3 V to V
30 mA, Whichever Occurs First
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Temperature Range
1
DD
+0.3 V or
ORDERING GUIDE
–4–
Package Description
Standard Small Outline (SOIC)
Standard Small Outline (SOIC)
Standard Small Outline (SOIC)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Standard Small Outline (SOIC)
Standard Small Outline (SOIC)
Standard Small Outline (SOIC)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Standard Small Outline (SOIC)
Standard Small Outline (SOIC)
Standard Small Outline (SOIC)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 520 mW
Lead Temperature, Soldering
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV
NOTES
1
2
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
limited to the maximum ratings given.
θ
θ
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
JA
JC
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 125°C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 42°C/W
WARNING!
Package Option
RU-16
RU-16
RU-16
RU-16
R-16
R-16
R-16
R-16
R-16
R-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
R-16
R-16
R-16
RU-16
RU-16
ESD SENSITIVE DEVICE
REV. A