BAP65-02,115 NXP Semiconductors, BAP65-02,115 Datasheet - Page 9

DIODE PIN 30V 100MA SOD-523

BAP65-02,115

Manufacturer Part Number
BAP65-02,115
Description
DIODE PIN 30V 100MA SOD-523
Manufacturer
NXP Semiconductors
Type
Attenuator/Switchr
Datasheets

Specifications of BAP65-02,115

Package / Case
SC-79, SOD-523
Diode Type
PIN - Single
Voltage - Peak Reverse (max)
30V
Current - Max
100mA
Capacitance @ Vr, F
0.375pF @ 20V, 1MHz
Resistance @ If, F
350 mOhm @ 100mA, 100MHz
Power Dissipation (max)
715mW
Configuration
Single
Reverse Voltage
30 V
Forward Continuous Current
100 mA
Termination Style
Solder Tails
Carrier Life
0.17 us
Forward Voltage Drop
0.9 V
Maximum Diode Capacitance
0.9 pF
Maximum Operating Temperature
+ 150 C
Maximum Series Resistance @ Maximum If
0.9 Ohms at 10 mA
Maximum Series Resistance @ Minimum If
0.95 Ohms at 5 mA
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Power Dissipation
715 mW
Forward Current
100mA
Forward Voltage
1.1V
Operating Temperature Classification
Military
Package Type
I-IGIA
Mounting
Surface Mount
Typical Carrier Life Time
170ns
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-1937-2
934056546115
BAP65-02 T/R

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAP65-02,115
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
12. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
8
9
10
10.1
10.2
10.3
10.4
11
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 6
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7
Contact information. . . . . . . . . . . . . . . . . . . . . . 8
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 28 September 2010
BAP65-02
Document identifier: BAP65-02
Silicon PIN diode
All rights reserved.

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