SL3S1002FTT,118 NXP Semiconductors, SL3S1002FTT,118 Datasheet - Page 2

• Manufacturer Part Number: SL3S1002FTT,118
• Description: SL3S1002FTT/TSSOP8/REEL13//
• Manufacturer: NXP Semiconductors

Specifications of SL3S1002FTT,118

• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Power Consumption: - 15 dBm
• Package / Case: TSSOP-8
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 935286501118

Standards Compliance
UCODE G2XM and UCODE G2XL are certified according
to EPCglobal Class1 Generation2 Version1.0.9 and conform
to EPCglobal Class1 Generation2 Version1.1.0.
Frequency Band
Electrical Parameter
* Modulated jammer, offset to carrier frequency > 1.0 MHz
Ordering information
www.nxp.com
Symbol
UHF
Description
Input chip capacitance
Quality factor
Minimum operating power
Interference signal suppression*
Part
UCODE G2XM
UCODE G2XL
©2007 NXP B.V.
All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The
information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable
and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Description
Frequency Band
Ordering number
SL3ICS1002FUG/V7AF
SL3S1002FTT
SL3FCS1002FC
SL3ICS1202FUG/V7AF
SL3S1202FTT
SL3FCS1202FC
Delivery type description
Bumped and sawn wafer on foil frame carrier (8 inch)
SMD package: TSSOP8
Flip chip package: Polymer strap
Bumped and sawn wafer on foil frame carrier (8 inch)
SMD package: TSSOP8
Flip chip package: Polymer strap
Min
840
Typ. value
0.9
9
- 15
- 4
Date of release: December 2007
Document order number: 9397 750 16225
Printed in the Netherlands
Max
960
Unit
MHz
Unit
pF
dBm
dB