HSMS-280F-TR2G Avago Technologies US Inc., HSMS-280F-TR2G Datasheet - Page 5

• Manufacturer Part Number: HSMS-280F-TR2G
• Description: DIODE SCHOTTKY RF CC 70V SOT-23
• Manufacturer: Avago Technologies US Inc.

Specifications of HSMS-280F-TR2G

• Package / Case: SC-70-3, SOT-323-3
• Diode Type: Schottky - 1 Pair Common Cathode
• Voltage - Peak Reverse (max): 70V
• Current - Max: 1A
• Capacitance @ Vr, F: 2pF @ 0V, 1MHz
• Resistance @ If, F: 35 Ohm @ 5mA, 1MHz
• Product: Schottky Diodes
• Peak Reverse Voltage: 70 V
• Forward Continuous Current: 1 A
• Max Surge Current: 1 A
• Configuration: Dual Common Cathode
• Forward Voltage Drop: 410 mV
• Maximum Reverse Leakage Current: 0.2 uA at 50 V
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation (max): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Applications Information Introduction —
Product Selection
Avago’s family of Schottky products provides unique
solutions to many design problems.
The first step in choosing the right product is to select the
diode type. All of the products in the HSMS-280x family
use the same diode chip, and the same is true of the
HSMS-281x and HSMS-282x families. Each family has a dif-
ferent set of characteristics which can be compared most
easily by consulting the SPICE parameters in Table 1.
A review of these data shows that the HSMS-280x family
has the highest breakdown voltage, but at the expense of
a high value of series resistance (R
do not require high voltage the HSMS-282x family, with a
lower value of series resistance, will offer higher current
carrying capacity and better performance. The HSMS-281x
family is a hybrid Schottky (as is the HSMS-280x), offering
lower 1/f or flicker noise than the HSMS-282x family.
In general, the HSMS-282x family should be the designer’s
first choice, with the -280x family reserved for high voltage
applications and the HSMS-281x family for low flicker
noise applications.
Assembly Instructions
SOT-323 PCB Footprint
A recommended PCB pad layout for the miniature SOT-
323 (SC-70) package is shown in Figure 6 (dimensions
are in inches). This layout provides ample allowance for
package placement by automated assembly equipment
without adding parasitics that could impair the perfor-
mance.
Table 1. Typical SPICE Parameters
5
Parameter
B
C
E
I
I
N
R
P
P
M
BV
S
G
V
J0
S
B
T
(XTI)
(V
J
)
Units
V
pF
eV
A
A
Ω
V
HSMS-280x
75
1.6
0.69
1 E-5
3 E-8
1.08
30
0.65
2
0.5
s
). In applications which
HSMS-281x
25
1.1
0.69
1 E-5
4.8 E-9
1.08
10
0.65
2
0.5
HSMS-282x
15
0.7
0.69
1 E-4
2.2 E-8
1.08
6
0.65
2
0.5
Figure 6. Recommended PCB Pad Layout for Avago’s SC70 3L/SOT-323
Products.
Assembly Instructions
SOT-363 PCB Footprint
A recommended PCB pad layout for the miniature SOT-
363 (SC-70, 6 lead) package is shown in Figure 7 (dimen-
sions are in inches). This layout provides ample allowance
for package placement by automated assembly equip-
ment without adding parasitics that could impair the
performance.
Figure 7. Recommended PCB Pad Layout for Avago’s SC70 6L/SOT-363
Products.
0.039
0.039
0.026
0.026
Dimensions in inches
0.022
Dimensions in inches
0.018
0.079
0.079