HSMS-280F-TR1G Avago Technologies US Inc., HSMS-280F-TR1G Datasheet - Page 5
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HSMS-280F-TR1G
Manufacturer Part Number
HSMS-280F-TR1G
Description
DIODE SCHOTTKY RF CC 70V SOT-23
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HSMS-2804-BLKG.pdf
(10 pages)
Specifications of HSMS-280F-TR1G
Diode Type
Schottky - 1 Pair Common Cathode
Voltage - Peak Reverse (max)
70V
Current - Max
1A
Capacitance @ Vr, F
2pF @ 0V, 1MHz
Resistance @ If, F
35 Ohm @ 5mA, 1MHz
Package / Case
SC-70-3, SOT-323-3
Diode Case Style
SOT-323
No. Of Pins
3
Peak Reflow Compatible (260 C)
Yes
Leaded Process Compatible
Yes
Forward Voltage
410mV
Repetitive Reverse Voltage Vrrm Max
70V
Forward Current If
1A
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation (max)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Applications Information Introduction —
Product Selection
Avago’s family of Schottky products provides unique
solutions to many design problems.
The first step in choosing the right product is to select the
diode type. All of the products in the HSMS-280x family
use the same diode chip, and the same is true of the
HSMS-281x and HSMS-282x families. Each family has a dif-
ferent set of characteristics which can be compared most
easily by consulting the SPICE parameters in Table 1.
A review of these data shows that the HSMS-280x family
has the highest breakdown voltage, but at the expense of
a high value of series resistance (R
do not require high voltage the HSMS-282x family, with a
lower value of series resistance, will offer higher current
carrying capacity and better performance. The HSMS-281x
family is a hybrid Schottky (as is the HSMS-280x), offering
lower 1/f or flicker noise than the HSMS-282x family.
In general, the HSMS-282x family should be the designer’s
first choice, with the -280x family reserved for high voltage
applications and the HSMS-281x family for low flicker
noise applications.
Assembly Instructions
SOT-323 PCB Footprint
A recommended PCB pad layout for the miniature SOT-
323 (SC-70) package is shown in Figure 6 (dimensions
are in inches). This layout provides ample allowance for
package placement by automated assembly equipment
without adding parasitics that could impair the perfor-
mance.
Table 1. Typical SPICE Parameters
5
Parameter
B
C
E
I
I
N
R
P
P
M
BV
S
G
V
J0
S
B
T
(XTI)
(V
J
)
Units
V
pF
eV
A
A
Ω
V
HSMS-280x
75
1.6
0.69
1 E-5
3 E-8
1.08
30
0.65
2
0.5
s
). In applications which
HSMS-281x
25
1.1
0.69
1 E-5
4.8 E-9
1.08
10
0.65
2
0.5
HSMS-282x
15
0.7
0.69
1 E-4
2.2 E-8
1.08
6
0.65
2
0.5
Figure 6. Recommended PCB Pad Layout for Avago’s SC70 3L/SOT-323
Products.
Assembly Instructions
SOT-363 PCB Footprint
A recommended PCB pad layout for the miniature SOT-
363 (SC-70, 6 lead) package is shown in Figure 7 (dimen-
sions are in inches). This layout provides ample allowance
for package placement by automated assembly equip-
ment without adding parasitics that could impair the
performance.
Figure 7. Recommended PCB Pad Layout for Avago’s SC70 6L/SOT-363
Products.
0.039
0.039
0.026
0.026
Dimensions in inches
0.022
Dimensions in inches
0.018
0.079
0.079