ON5402,518 NXP Semiconductors, ON5402,518 Datasheet - Page 3

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ON5402,518

Manufacturer Part Number
ON5402,518
Description
MOSFET RF 8SOIC
Manufacturer
NXP Semiconductors
Datasheet

Specifications of ON5402,518

Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
934059339518
1. Tested on a minimum footprint on a four-layer PCB per JEDEC specification JESD51-7.
Philips Semiconductors
ORDERING INFORMATION
Part number marking
The package is marked with the part number under the logo. The
second line indicates wafer lot number. The first four characters of
the third line contain a date code. The remaining characters are
manufacturing codes.
PIN CONFIGURATION
MAXIMUM RATINGS
NOTE:
2003 Apr 02
TYPE NUMBER
TYPE NUMBER
NE57811S
V
T
T
T
R
P
SYMBOL
amb
stg
j
DD
D
Advanced DDR memory termination power
with shutdown
th(j-a)
V
Operating ambient temperature
Storage temperature
Junction temperature
Thermal resistance, junction to ambient
Power dissipation (Note 1)
DD
Figure 2. Pin configuration.
to V
1
PACKAGE
NAME
SPAK-5
SS
voltage
2
3
DESCRIPTION
plastic single-ended surface mounted package; 5 leads
4
PARAMETER
5
SL01691
3
1. The thermal backside pad connects electrically to V
PIN DESCRIPTION
NOTE:
PIN
and provides enhancement to thermal conductivity, but it should
not be used as the primary connection to ground. Device
specifications apply to use of the V
ground.
1
2
3
4
5
V
V
V
SHTDWN
RefOut
TT
DD
SS
SYMBOL
MIN.
–0.3
–40
0
Regulated terminator voltage
Power supply
Circuit ground (Note 1)
Shutdown
Reference voltage out
VERSION
SOT756
TYP.
16.5
SS
DESCRIPTION
pin as the connection to
MAX.
+165
+3.6
+70
160
3.3
NE57811
TEMPERATURE
RANGE
0 C to +70 C
SS
Product data
internally
UNIT
C/W
W
V
C
C
C

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