PMBT3906YS,115 NXP Semiconductors, PMBT3906YS,115 Datasheet
PMBT3906YS,115
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PMBT3906YS T/R
PMBT3906YS T/R
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PMBT3906YS,115 Summary of contents
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PMBT3906YS 40 V, 200 mA PNP/PNP general-purpose double transistor Rev. 02 — 13 May 2009 1. Product profile 1.1 General description PNP/PNP general-purpose double transistor in a SOT363 (SC-88) very small Surface-Mounted Device (SMD) plastic package. Table 1. Type number ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin Ordering information Table 4. Type number PMBT3906YS 4. Marking Table 5. Type number PMBT3906YS [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China PMBT3906YS_2 Product data sheet 40 V, 200 mA PNP/PNP general-purpose double transistor Pinning Description emitter TR1 ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor V CBO V CEO V EBO tot Per device P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Fig 1. ...
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... NXP Semiconductors 6. Thermal characteristics Table 7. Symbol Per transistor R th(j-a) R th(j-sp) Per device R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint th(j-a) 0.75 (K/W) 0.5 0.33 2 0.2 10 0.1 0.05 0.02 0. FR4 PCB, standard footprint Fig 2. Per transistor: Transient thermal impedance from junction to ambient as a function of pulse duration; ...
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... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol Per transistor I CBO I EBO CEsat V BEsat off PMBT3906YS_2 Product data sheet 40 V, 200 mA PNP/PNP general-purpose double transistor Characteristics Parameter Conditions collector-base cut-off V CB current emitter-base cut-off V EB current DC current gain V CE ...
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... NXP Semiconductors 400 h FE (1) 300 200 (2) (3) 100 ( 150 C amb ( amb ( amb Fig 3. DC current gain as a function of collector current; typical values 1 (V) 1.0 (1) 0.8 (2) 0.6 (3) 0 amb ( amb ( 150 C amb Fig 5. Base-emitter voltage as a function of collector current; typical values PMBT3906YS_2 ...
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... NXP Semiconductors (1) T (2) T (3) T Fig 7. 8. Test information Fig 8. 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors , and is suitable for use in automotive applications. ...
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... NXP Semiconductors 9. Package outline Fig 9. 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package PMBT3906YS SOT363 [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping ...
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... NXP Semiconductors 11. Soldering Fig 10. Reflow soldering footprint SOT363 (SC-88) 4.5 Fig 11. Wave soldering footprint SOT363 (SC-88) PMBT3906YS_2 Product data sheet 40 V, 200 mA PNP/PNP general-purpose double transistor 2.65 1.5 2.35 0 1.8 1.3 1.3 2.45 5.3 Rev. 02 — 13 May 2009 PMBT3906YS 0 ...
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... NXP Semiconductors 12. Revision history Table 10. Revision history Document ID Release date PMBT3906YS_2 20090513 • Modifications: Figure PMBT3906YS_1 20080306 PMBT3906YS_2 Product data sheet 40 V, 200 mA PNP/PNP general-purpose double transistor Data sheet status Product data sheet 4: amended Product data sheet Rev. 02 — 13 May 2009 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 7 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Packing information Soldering ...