TFBS4711-TR1 Vishay, TFBS4711-TR1 Datasheet - Page 5

• Manufacturer Part Number: TFBS4711-TR1
• Description: IRDA TX/RX 0.1152Mbps 2.5V/3.3V/5V 6-Pin SMD T/R
• Manufacturer: Vishay
• Type: TX/RXr

Specifications of TFBS4711-TR1

• Package: 6SMD
• Maximum Communication Distance: 100(Typ) cm
• Half Intensity Angle Degrees: 44 °
• Maximum Data Rate: 0.1152 Mbps
• Peak Wavelength: 900(Max) nm
• Pulse Width: 2 us
• Radiant Intensity: 60 mW/sr
• Operating Supply Voltage: 2.4 to 5.5 V
• Wavelength: 900 nm
• Continual Data Transmission: 115.2 Kbit/s
• Transmission Distance: 1 m
• Maximum Rise Time: 100 ns
• Maximum Fall Time: 100 ns
• Led Supply Voltage: - 0.5 V to 6 V
• Operating Voltage: 2.4 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 6 mm x 3.1 mm x 1.9 mm
• Data Rate Max: 115.2Kbps
• Data Transmission Distance: 1m
• Supply Current: 600µA
• Supply Voltage Range: 2.4V To 5.5V
• Operating Temperature Range: -25°C To +85°C
• External Depth: 1.9mm
• Rohs Compliant: Yes
• Communication Cone: 15°
• Data Rate: 115.2kbs (SIR)
• Idle Current, Typ @ 25° C: 75µA
• Link Range, Low Power: 1m
• Operating Temperature: -30°C ~ 85°C
• Orientation: Side View
• Shutdown: *
• Size: 6mm x 3.1mm x 1.9mm
• Standards: IrPHY 1.2
• Supply Voltage: 2.7 V ~ 5.5 V
• Svhc: No SVHC (20-Jun-2011)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Recommended Solder Profiles
Solder Profile for Sn/Pb soldering
Lead (Pb)-Free, Recommended Solder Profile
The TFBS4711 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead
(Pb)-free solder paste like Sn(3.0-4.0)Ag(0.5-0.9)Cu,
there are two standard reflow profiles: Ramp-Soak-
Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-
Soak-Spike profile was developed primarily for reflow
ovens heated by infrared radiation. With widespread
use of forced convection reflow ovens the Ramp-To-
Spike profile is used increasingly. Shown below in fig-
ure 2 is VISHAY's recommended profiles for use with
the TFBS4711 transceivers. For more details please
refer to Application note: SMD Assembly Instruction.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Document Number 82633
Rev. 1.9, 07-Nov-06
260
240
220
200
180
160
140
120
100
80
60
40
20
Figure 1. Recommended Solder Profile for Sn/Pb soldering
0
0
2...4 °C/s
50
100
160 °C max.
120 s...180 s
240 °C max.
150
Time/s
200
2...4 °C/s
10 s max. at 230 °C
250
90 s max.
300
19431
350
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be rec-
ommended because the risk of damage is highly
dependent on the experience of the operator. Never-
theless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equiva-
lent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
19261
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
2 °C...4 °C/s
Figure 2. Solder Profile, RSS Recommendation
50
T ≥ 255 °C for 20 s max
T ≥ 217 °C for 50 s max
100
90 s...120 s
Vishay Semiconductors
150
Time/s
200
50 s max.
20 s
TFBS4711
T peak = 260 °C max.
250
www.vishay.com
2 °C...4 °C/s
300
350
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