CC109155314 Lineage Power, CC109155314 Datasheet - Page 18

• Manufacturer Part Number: CC109155314
• Description: Module DC-DC 1-OUT 0.7V to 2V 50A 14-Pin SMT T/R
• Manufacturer: Lineage Power
• Type: Step Downr

Specifications of CC109155314

• Package: 14SMT
• Output Current: 50 A
• Output Voltage: 0.7 to 2 V
• Input Voltage: 4.5 to 14 V
• Number Of Outputs: 1
• Switching Regulator: Yes
• Lead Free Status / Rohs Status: Supplier Unconfirmed

Data Sheet
March 30, 2011
Surface Mount Information
Pick and Place
The Giga TLynx
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300
product information such as product code, serial
number and location of manufacture.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and pick &
placement speed should be considered to optimize
this process. The minimum recommended inside
nozzle diameter for reliable operation is 3mm. The
maximum nozzle outer diameter, which will safely fit
within the allowable component spacing, is 5 mm
max.
Bottom Side Assembly
This module is not recommended for assembly
on the bottom side of a customer board. If such
an assembly is attempted, components may fall
off the module during the second reflow process.
If assembly on the bottom side is planned, please
LINEAGE
Figure 31. Pick and Place Location.
POWER
TM
SMT modules use an open frame
o
C. The label also carries
4.5 – 14Vdc input; 0.7Vdc to 2.0Vdc, 50A Output
GigaTLynx
contact Lineage Power for special manufacturing
process instructions.
Lead-free (Pb-free) Soldering
The –Z version Giga TLynx modules
(Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and
a SnPb soldering process
instructions below may result in the failure of or
cause damage to the modules and can
adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow
Nonhermetic Solid State Surface Mount Devices)
for
classification procedures. This standard provides
a
profile based on the volume and thickness of the
package (table 4-2). The suggested Pb-free solder
paste is Sn/Ag/Cu (SAC).
Recommended linear reflow profile using Sn/Ag/Cu
solder:
NOTE:
profile requires testing to verify results and
performance.
Tin Lead Soldering
The Giga TLynx
modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
300
250
200
150
100
recommended
50
0
both
TM
Per J-STD-020 Rev. C
Soldering outside of the recommended
Heating Zone
SMT Non-isolated Power Modules:
1°C/Second
Pb-free
TM
SMT power modules are lead free
Sensitivity
Peak Temp 260°C
forced-air-convection
solder
Reflow Time (Seconds)
. Failure to observe the
profiles
* Min. Time Above 235°C
Classification
*Time Above 217°C
are lead-free
60 Seconds
15 Seconds
and
reflow
18
MSL
Cooling Zone
for
4°C/Second