CC109155314 Lineage Power, CC109155314 Datasheet - Page 19

• Manufacturer Part Number: CC109155314
• Description: Module DC-DC 1-OUT 0.7V to 2V 50A 14-Pin SMT T/R
• Manufacturer: Lineage Power
• Type: Step Downr

Specifications of CC109155314

• Package: 14SMT
• Output Current: 50 A
• Output Voltage: 0.7 to 2 V
• Input Voltage: 4.5 to 14 V
• Number Of Outputs: 1
• Switching Regulator: Yes
• Lead Free Status / Rohs Status: Supplier Unconfirmed

Data Sheet
March 30, 2011
damage to the modules, and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
Figure 32. Reflow Profile for Tin/Lead (Sn/Pb)
process.
LINEAGE
o
300
200
240
235
230
225
220
205
200
C. Typically, the eutectic solder melts at 183
250
100
215
210
150
50
0
0
POWER
10
Heat zo ne
max 4
P reheat zo ne
max 4
P eak Temp 235
20
REFLOW TIME (S)
o
Cs
o
So ak zo ne
30-240s
Cs
-1
-1
30
o
C
40
T
205
lim
o
above
C
Co o ling
zo ne
1 -4
50
o
Cs
-1
o
C,
60
4.5 – 14Vdc input; 0.7Vdc to 2.0Vdc, 50A Output
GigaTLynx
Figure 33. Time Limit Curve Above 205
for Tin Lead (Sn/Pb) process.
MSL Rating
The Giga TLynx
of 2.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of <= 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning Application Note
(AN04-001).
TM
SMT Non-isolated Power Modules:
TM
SMT modules have a MSL rating
o
C Reflow
19