LFXP3C-3QN208C LATTICE SEMICONDUCTOR, LFXP3C-3QN208C Datasheet - Page 115
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LFXP3C-3QN208C
Manufacturer Part Number
LFXP3C-3QN208C
Description
FPGA LatticeXP Family 3000 Cells 320MHz 130nm (CMOS) Technology 1.8V/2.5V/3.3V 208-Pin PQFP Tray
Manufacturer
LATTICE SEMICONDUCTOR
Datasheet
1.LFXP3C-3QN208C.pdf
(130 pages)
Specifications of LFXP3C-3QN208C
Package
208PQFP
Family Name
LatticeXP
Device Logic Units
3000
Maximum Internal Frequency
320 MHz
Typical Operating Supply Voltage
1.8|2.5|3.3 V
Maximum Number Of User I/os
136
Ram Bits
55296
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFXP3C-3QN208C
Manufacturer:
Lattice
Quantity:
135
Company:
Part Number:
LFXP3C-3QN208C
Manufacturer:
LOGIC
Quantity:
4
Company:
Part Number:
LFXP3C-3QN208C
Manufacturer:
LATTICE
Quantity:
1 360
Company:
Part Number:
LFXP3C-3QN208C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
Part Number:
LFXP3C-3QN208C
Manufacturer:
LATTICE
Quantity:
20 000
Pinout Information
Lattice Semiconductor
LatticeXP Family Data Sheet
Thermal Management
Thermal management is recommended as part of any sound FPGA design methodology. To assess the thermal
characteristics of a system, Lattice specifies a maximum allowable junction temperature in all device data sheets.
Designers must complete a thermal analysis of their specific design to ensure that the device and package do not
exceed the junction temperature limits. Refer to the Thermal Management document to find the device/package
specific thermal values.
For Further Information
For further information regarding Thermal Management, refer to the following located on the Lattice website at
www.latticesemi.com.
• Thermal Management document
• Technical Note TN1052 - Power Estimation and Management for LatticeECP/EC and LatticeXP Devices
• Power Calculator tool included with Lattice’s ispLEVER design tool, or as a standalone download from
www.latticesemi.com/software
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