XC2S400E-6FGG456C Xilinx Inc, XC2S400E-6FGG456C Datasheet - Page 56

• Manufacturer Part Number: XC2S400E-6FGG456C
• Description: FPGA Spartan®-IIE Family 400K Gates 10800 Cells 357MHz 0.15um Technology 1.8V 456-Pin FBGA
• Manufacturer: Xilinx Inc
• Series: Spartan™-IIEr

Specifications of XC2S400E-6FGG456C

• Package: 456FBGA
• Family Name: Spartan®-IIE
• Device Logic Cells: 10800
• Device Logic Units: 2400
• Device System Gates: 400000
• Maximum Internal Frequency: 357 MHz
• Typical Operating Supply Voltage: 1.8 V
• Maximum Number Of User I/os: 329
• Ram Bits: 163840
• Number Of Logic Elements/cells: 10800
• Number Of Labs/clbs: 2400
• Total Ram Bits: 163840
• Number Of I /o: 329
• Number Of Gates: 400000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 456-BBGA
• Case: BGA
• Dc: 05+
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 122-1327

Spartan-IIE FPGA Family: Pinout Tables
Package Thermal Characteristics
Table 14
Spartan-II FPGA package offerings. This information is also
available using the Thermal Query tool on xilinx.com
(www.xilinx.com/cgi-bin/thermal/thermal.pl).
The junction-to-case thermal resistance (θ
difference between the temperature measured on the
package body (case) and the die junction temperature per
watt of power consumption. The junction-to-board (θ
Table 14: Spartan-IIE Package Thermal Characteristics
56
Package
TQG144
PQG208
FGG456
FGG676
FTG256
PQ208
TQ144
FG456
FG676
FT256
provides the thermal characteristics for the various
XC2S100E
XC2S100E
XC2S150E
XC2S200E
XC2S300E
XC2S100E
XC2S150E
XC2S200E
XC2S300E
XC2S400E
XC2S100E
XC2S150E
XC2S200E
XC2S300E
XC2S400E
XC2S600E
XC2S400E
XC2S600E
XC2S50E
XC2S50E
XC2S50E
Device
Junction-to-Case
(θ
5.8
5.3
7.1
6.1
6.0
4.6
4.0
7.3
5.8
5.7
3.9
3.2
2.5
8.4
8.2
6.3
5.6
3.6
2.7
4.1
3.4
JC
)
JC
) indicates the
Junction-to-
Board (θ
JB
)
www.xilinx.com
17.8
15.1
14.8
11.4
10.1
14.9
14.6
11.6
10.4
N/A
N/A
N/A
N/A
N/A
N/A
N/A
8.8
6.5
5.0
7.9
6.9
JB
)
value similarly reports the difference between the board and
junction temperature. The junction-to-ambient (θ
reports the temperature difference between the ambient
environment and the junction temperature. The θ
reported at different air velocities, measured in linear feet
per minute (LFM). The “Still Air (0 LFM)” column shows the
θ
drops with increasing air flow.
JA
Still Air
(0 LFM)
value in a system without a fan. The thermal resistance
32.3
31.4
35.1
34.2
34.1
32.4
31.6
27.4
25.0
24.8
21.9
20.8
19.7
24.3
24.1
21.0
19.9
17.7
17.3
15.6
14.5
Junction-to-Ambient (θ
at Different Air Flows
250 LFM
25.1
24.4
25.9
25.2
25.2
23.9
23.3
21.6
19.5
19.3
16.6
15.6
14.5
19.2
19.0
16.1
15.1
11.7
11.2
11.1
9.9
500 LFM
21.5
20.8
22.9
22.3
22.2
21.2
20.6
20.4
18.2
18.0
15.2
14.2
13.2
18.1
17.9
15.0
13.9
10.5
10.0
9.8
8.6
DS077-4 (2.3) June 18, 2008
JA
)
750 LFM
Product Specification
20.1
19.6
21.2
20.7
20.6
19.6
19.1
20.0
17.8
17.6
14.7
13.7
12.6
17.4
17.1
14.3
13.2
10.0
9.5
9.2
7.9
JA
JA
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
) value
Units
value is
R