BGD502 NXP Semiconductors, BGD502 Datasheet
BGD502
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BGD502 Summary of contents
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... DATA SHEET dbook, halfpage BGD502 550 MHz, 18.5 dB gain power doubler amplifier Product specification Supersedes data of 1995 Oct 25 DISCRETE SEMICONDUCTORS M3D252 2001 Nov 15 ...
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... T storage temperature stg T operating mounting base temperature mb 2001 Nov 15 PINNING - SOT115J PIN handbook, halfpage Side view CONDITIONS MHz f = 550 MHz PARAMETER 2 Product specification BGD502 DESCRIPTION input common +V B common output MSA319 Fig.1 Simplified outline. MIN. MAX 18.8 20.8 435 MIN. ...
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... MHz 77 channels flat dBmV; o measured at 55.25 MHz 77 channels flat dBmV; o measured at 548.5 MHz note 1 = 60 dB; note 550 MHz note 3 3 Product specification BGD502 MIN. TYP. MAX. UNIT 18.8 20.8 dB 0.2 2.2 dB 0.3 dB ...
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... MHz 60 channels flat dBmV; o measured at 446.5 MHz 60 channels flat dBmV; o measured at 55.25 MHz note 1 = 60 dB; note 450 MHz note 3 4 Product specification BGD502 MIN. TYP. MAX. UNIT 18.6 20.6 dB 0.2 1.8 dB 0.3 dB ...
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... REFERENCES JEDEC JEITA 8.2 6-32 44.25 7.8 UNC EUROPEAN PROJECTION Product specification BGD502 SOT115J max. 0.25 0.7 0.1 3.8 ISSUE DATE 04-02-04 10-06-18 ...
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... Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. 6 Product specification BGD502 DEFINITION ...
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... NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 7 Product specification BGD502 ...
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... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...