BC847AW,115 NXP Semiconductors, BC847AW,115 Datasheet
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BC847AW,115
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BC847AW T/R
BC847AW T/R
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BC847AW,115 Summary of contents
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BC847/BC547 series 45 V, 100 mA NPN general-purpose transistors Rev. 07 — 10 December 2008 1. Product profile 1.1 General description NPN general-purpose transistors in small plastic packages. Table 1. Type number BC847 BC847A BC847B BC847B/DG BC847C BC847W BC847AW BC847BW ...
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... NXP Semiconductors 1.2 Features I Low current I Low voltage I Three different gain selections 1.3 Applications I General-purpose switching and amplification 1.4 Quick reference data Table 2. Symbol V CEO Pinning information Table 3. Pin SOT23, SOT323, SOT416 SOT883 BC847_BC547_SER_7 Product data sheet 45 V, 100 mA NPN general-purpose transistors ...
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... NXP Semiconductors Table 3. Pin SOT54 SOT54A SOT54 variant Ordering information Table 4. Type number BC847 BC847A BC847B BC847B/DG BC847C BC847W BC847AW BC847BW BC847BW/DG BC847CW BC847_BC547_SER_7 Product data sheet 45 V, 100 mA NPN general-purpose transistors Pinning …continued Description emitter base collector emitter base collector ...
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... NXP Semiconductors Table 4. Type number BC847T BC847AT BC847AT/DG BC847BT BC847CT BC847AM BC847BM BC847CM [2] BC547 BC547B BC547C [1] /DG: halogen-free [2] Also available in SOT54 and SOT54 variant packages (see 4. Marking Table 5. Type number BC847 BC847A BC847B BC847B/DG BC847C BC847W BC847AW BC847BW BC847BW/DG BC847CW BC847T ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. ...
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... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol Parameter I CBO I EBO CEsat V BEsat [1] Pulse test BC847_BC547_SER_7 Product data sheet Characteristics Conditions collector-base cut-off current 150 C j emitter-base cut-off current DC current gain h group group group current gain group group group ...
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... NXP Semiconductors 400 h FE (1) 300 (2) 200 (3) 100 ( 150 C amb ( amb ( amb Fig 1. Selection A: DC current gain as a function of collector current; typical values CEsat (mV (1) ( 150 C amb ( amb ( amb Fig 3. Selection A: Collector-emitter saturation voltage as a function of collector current; typical values BC847_BC547_SER_7 Product data sheet ...
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... NXP Semiconductors 600 h FE (1) 500 400 (2) 300 200 (3) 100 ( 150 C amb ( amb ( amb Fig 5. Selection B: DC current gain as a function of collector current; typical values CEsat (mV (1) ( 150 C amb ( amb ( amb Fig 7. Selection B: Collector-emitter saturation voltage as a function of collector current; typical values ...
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... NXP Semiconductors 1200 h FE 1000 (1) 800 (2) 600 400 (3) 200 ( 150 C amb ( amb ( amb Fig 9. Selection C: DC current gain as a function of collector current; typical values CEsat (mV (1) ( 150 C amb ( amb ( amb Fig 11. Selection C: Collector-emitter saturation voltage as a function of collector current; typical values ...
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... NXP Semiconductors 8. Package outline 3.0 2.8 3 2.5 1.4 2.1 1.2 1 1.9 Dimensions in mm Fig 13. Package outline SOT23 (TO-236AB) 1.8 1.4 3 1.75 0.9 1.45 0 Dimensions in mm Fig 15. Package outline SOT416 (SC-75) 4.2 3.6 4.8 4.4 5.2 14.5 5.0 12.7 Dimensions in mm Fig 17. Package outline SOT54 (SC-43A/TO-92) ...
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... NXP Semiconductors Fig 19. Package outline SOT54 variant 9. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BC847 BC847A BC847B BC847B/DG BC847C BC847W BC847AW BC847BW BC847BW/DG BC847CW BC847T BC847AT BC847AT/DG BC847BT BC847CT BC847AM BC847BM ...
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... NXP Semiconductors Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BC547 BC547B BC547C BC547 BC547B BC547C BC547 BC547B BC547C [1] For further information and the availability of packing methods, see [2] /DG: halogen-free BC847_BC547_SER_7 Product data sheet ...
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... Product data sheet Data sheet status Product data sheet The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Table 1 “Product overview”: enhanced Table 4 “ ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 13. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 9 Packing information Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 11 Legal information ...