1747314-1 TE Connectivity, 1747314-1 Datasheet - Page 65
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1747314-1
Manufacturer Part Number
1747314-1
Description
Manufacturer
TE Connectivity
Type
SIMr
Datasheet
1.1747314-1.pdf
(116 pages)
Specifications of 1747314-1
Gender
M
Mounting Style
Surface Mount
Termination Method
Solder
Body Orientation
Straight
Contact Pitch (mm)
2.54mm
Housing Material
Thermoplastic
Contact Material
Phosphor Bronze
Contact Pitch
2.54mm
Product Type
Connector
Card Type
2FF mini SIM
Card Guide Slots
With
Pcb Mount Style
Surface Mount
Contact Retention
No
Connector Stabilization Ribs
Without
Height Above Pc Board (mm [in])
1.96 [0.077]
Card Stop
With
Ejector Type
Push - Pull
Centerline (mm [in])
2.54 [0.100]
Durability Rating
5000 Cycles
Contact Base Material
Phosphor Bronze
Number Of Contacts
6
Housing Color
Black
Ul Flammability Rating
UL 94V-0
Card Insertion Style
Normal Insertion
Card Detection Switch
Without
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C
Rohs/elv Compliance History
Always was RoHS compliant
Packaging Method
Tape & Reel
Packaging Quantity
1,000/Reel
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
1747314-1
Manufacturer:
AMP
Quantity:
10 000
MID Technology
at Tyco Electronics
Tyco Electronics prides itself
in being the global leader in
providing Molded Interconnect
Technology (MID). In it’s most
basic form, MID technology
can be defined as any product
that results in selectively plated
plastic parts. This technology
can be used in three basic
ways, to solve 3-dimensional
electro-mechanical problems,
for shielding purposes, or to
develop antennas.
MID Technologies
Tyco Electronics can manu-
facture MID parts using three
manufacturing technologies,
Two Shot, Laser Imaging, and
Laser Direct Structuring.
Products for Mobile Equipment
MID Technology
MID
Two Shot MID Technology
Two Shot
■
■
■
■
Laser Imaging MID Technology
Laser Imaging today is typically only used for rapid prototyping
■
■
■
■
All specifications subject to change. Consult Tyco Electronics for latest specifications.
Sequential injection molded substrate
A plateable resin and a non-plateable resin
Imaging in the molding process
All electroless plating of catalyzed surfaces
Manufacturing using a circuit board production type process
Machine or single shot mold in 3–10 days
Laser image circuitry in 3–5 days
Circuitry and plating are accurate to production processes
Catalog 1654270-2
Revised 8-2007
63