1747314-1 TE Connectivity, 1747314-1 Datasheet - Page 66
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1747314-1
Manufacturer Part Number
1747314-1
Description
Manufacturer
TE Connectivity
Type
SIMr
Datasheet
1.1747314-1.pdf
(116 pages)
Specifications of 1747314-1
Gender
M
Mounting Style
Surface Mount
Termination Method
Solder
Body Orientation
Straight
Contact Pitch (mm)
2.54mm
Housing Material
Thermoplastic
Contact Material
Phosphor Bronze
Contact Pitch
2.54mm
Product Type
Connector
Card Type
2FF mini SIM
Card Guide Slots
With
Pcb Mount Style
Surface Mount
Contact Retention
No
Connector Stabilization Ribs
Without
Height Above Pc Board (mm [in])
1.96 [0.077]
Card Stop
With
Ejector Type
Push - Pull
Centerline (mm [in])
2.54 [0.100]
Durability Rating
5000 Cycles
Contact Base Material
Phosphor Bronze
Number Of Contacts
6
Housing Color
Black
Ul Flammability Rating
UL 94V-0
Card Insertion Style
Normal Insertion
Card Detection Switch
Without
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C
Rohs/elv Compliance History
Always was RoHS compliant
Packaging Method
Tape & Reel
Packaging Quantity
1,000/Reel
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
1747314-1
Manufacturer:
AMP
Quantity:
10 000
64
Products for Mobile Equipment
MID Technology
MID
Laser Direct Structuring Technology
Laser Direct Structuring (LDS) Technology
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3D Part Design
Tyco Electronics provides its customers vast design expertise over a wide variety of manufac-
turing technologies. Our design engineers are experts in two shot design and product integration
for MID products. Optimal solutions are engineered with the appropriate MID technology to best
suit the application.
Modeling and Simulation
Tyco Electroniocs employs the most up
to date design tools available. We use
sophisticated 3D modeling and simulation
packages to accurately manufacture and
predict the end product.
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All specifications subject to change. Consult Tyco Electronics for latest specifications.
Offers the ability to create parts with finer line width and spacing than conventional MID
processes will allow for.
The structure is molded in a standard single shot mold using one of several proprietary plastics
available.
Desired interconnect pattern is directly written on the resulting molded part and the conductive
paths are plated using industry standard methods.
The plating adheres only where the plastic has been activated by the laser.
Pro Engineer Wildfire 2.0 CAD software
Auto CAD 2005
MPA Moldflow to predict molding
behaviors
Pro Mechanica stress and thermal
analysis software
Catalog 1654270-2
Revised 8-2007