BCP52,135 NXP Semiconductors, BCP52,135 Datasheet
BCP52,135
Specifications of BCP52,135
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BCP52,135 Summary of contents
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BCP52; BCX52 PNP medium power transistors Rev. 08 — 25 February 2008 1. Product profile 1.1 General description PNP medium power transistor series. Table 1. Type number BCP52 BCX52 [1] Valid for all available selection groups. ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin SOT223 SOT89 Ordering information Table 4. Type number BCP52 BCX52 [1] Valid for all available selection groups. 4. Marking Table 5. Type number BCP52 BCP52-10 BCP52-16 BCX52 BCX52-10 BCX52-16 BCP52_BCX52_8 Product data sheet Pinning Description base collector emitter collector ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm ...
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... NXP Semiconductors 1.6 P tot (W) 1.2 (1) 0.8 (2) 0 (1) FR4 PCB, mounting pad for collector 1 cm (2) FR4 PCB, standard footprint Fig 1. Power derating curves SOT223 6. Thermal characteristics Table 7. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm ...
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... NXP Semiconductors th(j-a) duty cycle = (K/ 0.5 0.33 0.2 0.1 10 0.05 0.02 0. FR4 PCB, standard footprint Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values 3 10 duty cycle = Z th(j-a) (K/W) 1 0.75 0.5 0.33 0.2 ...
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... NXP Semiconductors duty cycle = th(j-a) (K/W) 1 0.75 2 0.5 10 0.33 0.2 0.1 0.05 10 0.02 0. FR4 PCB, standard footprint Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typical values th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.2 0 ...
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... NXP Semiconductors 3 10 duty cycle = Z th(j-a) (K/W) 1 0.75 0.5 0.33 0.2 10 0.1 0.05 0.02 0. FR4 PCB, mounting pad for collector 6 cm Fig 7. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typical values 7. Characteristics Table unless otherwise specified. ...
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... NXP Semiconductors 300 ( 200 (2) 100 ( ( 150 C amb ( amb ( amb Fig 8. DC current gain as a function of collector current; typical values 1200 V BE (mV) 1000 (1) 800 (2) 600 (3) 400 200 ( amb ( amb ( 150 C amb Fig 10. Base-emitter voltage as a function of collector current; typical values BCP52_BCX52_8 Product data sheet ...
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... NXP Semiconductors 8. Package outline 6.7 6.3 3.1 2.9 4 7.3 3.7 6.7 3 2.3 4.6 Dimensions in mm Fig 12. Package outline SOT223 (SC-73) 9. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BCP52 BCX52 [1] For further information and the availability of packing methods, see [2] Valid for all available selection groups ...
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... NXP Semiconductors 10. Revision history Table 10. Revision history Document ID Release date BCP52_BCX52_8 20080225 • Modifications: • BC638_BCP52_BCX52_7 20070626 BC638_BCP52_BCX52_6 20060329 BC636_638_640_5 20041011 BCP51_52_53_5 20030206 BCX51_52_53_4 20011010 BCP52_BCX52_8 Product data sheet Data sheet status Product data sheet Type numbers BC638 and BC638-16 have been removed ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 13. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 Packing information Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 11 Legal information ...