BCP69,115 NXP Semiconductors, BCP69,115 Datasheet
BCP69,115
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BCP69,115 Summary of contents
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BCP69 PNP medium power transistor Rev. 06 — 2 December 2008 1. Product profile 1.1 General description PNP medium power transistor in a Surface-Mounted Device (SMD) plastic package. Table 1. Type number BCP69 BCP69-16 BCP69-16/DG BCP69-16/IN ...
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... NXP Semiconductors Table 2. Symbol Pinning information Table 3. Pin Ordering information Table 4. Type number BCP69 BCP69-16 BCP69-16/DG BCP69-16/IN BCP69-25 [1] /DG: halogen-free BCP69_6 Product data sheet Quick reference data …continued Parameter Conditions DC current gain 500 mA C BCP69 BCP69-16 BCP69-16/DG BCP69-16/IN BCP69-25 Pinning Description ...
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... NXP Semiconductors 4. Marking Table 5. Type number BCP69 BCP69-16 BCP69-16/DG BCP69-16/IN BCP69-25 [1] /DG: halogen-free 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint ...
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... NXP Semiconductors (1) FR4 PCB, mounting pad for collector 6 cm (2) FR4 PCB, mounting pad for collector 1 cm (3) FR4 PCB, standard footprint Fig 1. 6. Thermal characteristics Table 7. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm ...
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... NXP Semiconductors 2 10 duty cycle = 1 0.75 R th(j-a) 0.5 (K/W) 0.33 0.2 10 0.1 0.05 0.02 0. FR4 PCB, mounting pad for collector 6 cm Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values BCP69_6 Product data sheet Rev. 06 — 2 December 2008 ...
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... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol I CBO I EBO CEsat BCP69_6 Product data sheet Characteristics Parameter Conditions collector-base cut-off current 150 C j emitter-base cut-off current DC current gain BCP69 500 BCP69- BCP69-16/ 500 mA C BCP69-16/ 500 mA C BCP69- 500 mA ...
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... NXP Semiconductors Fig 3. BCP69-16: DC current gain as a function of collector current; typical values 1000 V BE (mV) 800 600 400 200 Fig 5. BCP69-16: Base-emitter voltage as a function of collector current; typical values BCP69_6 Product data sheet mle305 I ( (mA) C Fig 4. mle304 V CEsat (mV (mA) C Fig 6. Rev. 06 — 2 December 2008 PNP medium power transistor 2 ...
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... NXP Semiconductors Fig 7. BCP69-25: DC current gain as a function of collector current; typical values 1000 V BE (mV) 800 600 400 200 Fig 9. BCP69-25: Base-emitter voltage as a function of collector current; typical values BCP69_6 Product data sheet mle309 I ( (mA) C Fig 8. mle304 V CEsat (mV (mA) C Fig 10. BCP69-25: Collector-emitter saturation voltage Rev. 06 — ...
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... NXP Semiconductors 8. Package outline Fig 11. Package outline SOT223 (SC-73) 9. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BCP69 BCP69-16 BCP69-16/DG BCP69-16/IN BCP69-25 [1] For further information and the availability of packing methods, see [2] /DG: halogen-free ...
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... NXP Semiconductors 10. Soldering 1.3 1 Fig 12. Reflow soldering footprint SOT223 (SC-73) 1.9 Fig 13. Wave soldering footprint SOT223 (SC-73) BCP69_6 Product data sheet 7 3.85 3.6 3.5 0 2.3 2 6.15 8.9 6 2.7 2.7 1.9 1 Rev. 06 — 2 December 2008 BCP69 PNP medium power transistor ...
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... Release date BCP69_6 20081202 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Table 1 “Product • Table 4 “Ordering • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 14. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 12 Legal information ...