BCP69-25 /T3 NXP Semiconductors, BCP69-25 /T3 Datasheet
BCP69-25 /T3
Specifications of BCP69-25 /T3
Related parts for BCP69-25 /T3
BCP69-25 /T3 Summary of contents
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... BCP69; BC869; BC69PA PNP medium power transistors Rev. 7 — 12 October 2011 1. Product profile 1.1 General description PNP medium power transistor series in Surface-Mounted Device (SMD) plastic packages. Table 1. Type number BCP69 BC869 BC69PA [1] Valid for all available selection groups. 1.2 Features and benefits ...
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... Pulse test Pinning information Table 3. Pin SOT223 SOT89 SOT1061 BCP69_BC869_BC69PA Product data sheet BCP69; BC869; BC69PA Quick reference data …continued Parameter Conditions = current gain 500 selection - 500 ...
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... Type number BCP69 BCP69-16 BCP69-25 BC869 BC869-16 BC869-25 BC69PA BC69-16PA BC69-25PA BCP69_BC869_BC69PA Product data sheet BCP69; BC869; BC69PA Ordering information [1] Package Name Description SC-73 plastic surface-mounted package with increased heatsink; 4 leads SC-62 plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads HUSON3 plastic thermal enhanced ultra thin small outline package ...
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... Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm BCP69_BC869_BC69PA Product data sheet BCP69; BC869; BC69PA Limiting values Parameter Conditions collector-base voltage open emitter collector-emitter voltage ...
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... FR4 PCB, single-sided copper, mounting pad for collector 6 cm (3) FR4 PCB, single-sided copper, mounting pad for collector 1 cm (4) FR4 PCB, 4-layer copper, standard footprint (5) FR4 PCB, single-sided copper, standard footprint Fig 3. Power derating curves SOT1061 BCP69_BC869_BC69PA Product data sheet BCP69; BC869; BC69PA 006aac674 75 125 175 T (°C) amb ...
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... Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm BCP69_BC869_BC69PA Product data sheet BCP69; BC869; BC69PA Thermal characteristics Parameter Conditions thermal resistance from in free air junction to ambient ...
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... FR4 PCB, mounting pad for collector 1 cm Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values BCP69_BC869_BC69PA Product data sheet BCP69; BC869; BC69PA –3 –2 – –3 –2 – ...
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... FR4 PCB, standard footprint Fig 7. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typical values BCP69_BC869_BC69PA Product data sheet BCP69; BC869; BC69PA –3 –2 – –3 –2 – All information provided in this document is subject to legal disclaimers. ...
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... FR4 PCB, mounting pad for collector 6 cm Fig 9. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typical values BCP69_BC869_BC69PA Product data sheet BCP69; BC869; BC69PA –3 –2 – –3 –2 –1 10 ...
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... FR4 PCB, single-sided copper, mounting pad for collector 1 cm Fig 11. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values BCP69_BC869_BC69PA Product data sheet BCP69; BC869; BC69PA –3 –2 – –3 –2 –1 ...
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... FR4 PCB, 4-layer copper, standard footprint Fig 13. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values BCP69_BC869_BC69PA Product data sheet BCP69; BC869; BC69PA –3 –2 – –3 –2 – All information provided in this document is subject to legal disclaimers ...
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... FR4 PCB, 4-layer copper, mounting pad for collector 1 cm Fig 14. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values BCP69_BC869_BC69PA Product data sheet BCP69; BC869; BC69PA –3 –2 – All information provided in this document is subject to legal disclaimers. ...
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... Symbol I CBO I EBO CEsat [1] Pulse test: t BCP69_BC869_BC69PA Product data sheet BCP69; BC869; BC69PA Characteristics C unless otherwise specified. Parameter Conditions = collector-base cut-off V CB current = 150 emitter-base cut-off V ...
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... C Fig 16. h 006aac698 -10 -10 -10 I (mA) C Fig 18. h All information provided in this document is subject to legal disclaimers. Rev. 7 — 12 October 2011 BCP69; BC869; BC69PA PNP medium power transistors −2 (A) −2.0 (mA) = −18 −1.6 −1.2 −0.8 −0.4 0 −1 − ...
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... C Fig 20. h 006aac708 -10 -10 -10 I (mA) C Fig 22. h All information provided in this document is subject to legal disclaimers. Rev. 7 — 12 October 2011 BCP69; BC869; BC69PA PNP medium power transistors −2 (A) (mA) = −12.0 −2 −1.6 −1.2 −0.8 −0.4 0 −1 − ...
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... This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 9. Package outline Fig 23. Package outline SOT223 (SC-73) Fig 24. Package outline SOT89 (SC-62/TO-243) BCP69_BC869_BC69PA Product data sheet BCP69; BC869; BC69PA 6.7 6.3 3.1 2.9 7.3 3.7 6.7 3 ...
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... pitch tape and reel; T3 SOT1061 4 mm pitch tape and reel All information provided in this document is subject to legal disclaimers. Rev. 7 — 12 October 2011 BCP69; BC869; BC69PA PNP medium power transistors 1.3 0.65 max 0. ...
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... All information provided in this document is subject to legal disclaimers. Rev. 7 — 12 October 2011 BCP69; BC869; BC69PA PNP medium power transistors 3.9 6.1 7.65 6.2 8.7 3 1.9 (3×) solder lands solder resist solder paste occupied area Dimensions in mm sot223_fr solder lands ...
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... NXP Semiconductors 0.85 4.6 Fig 28. Reflow soldering footprint SOT89 (SC-62/TO-243) 7.6 Fig 29. Wave soldering footprint SOT89 (SC-62/TO-243) BCP69_BC869_BC69PA Product data sheet BCP69; BC869; BC69PA 4.75 2.25 2 1.9 1.2 0.2 1.2 1 (3×) 1.5 1.5 3.95 6.6 2.4 3.5 0.5 1.8 (2×) 1.9 1.9 1.5 0.7 (2×) 5.3 All information provided in this document is subject to legal disclaimers. Rev. 7 — 12 October 2011 PNP medium power transistors 1 ...
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... BCP69_BC869_BC69PA Product data sheet 1.05 0.6 0.55 2.3 solder paste = solder lands solder resist Reflow soldering is the only recommended soldering method. All information provided in this document is subject to legal disclaimers. Rev. 7 — 12 October 2011 BCP69; BC869; BC69PA PNP medium power transistors 2.1 1.3 0.5 (2×) 0.4 (2×) 0.5 (2×) 0.25 0.4 0.5 1.6 1 ...
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... The format of this document has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Type number BC69PA added • Type number BCP69-16/DG and BCP69-16/IN removed • Section 1 “Product profile”: updated • Section 2 “Pinning information”: updated • ...
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... BCP69_BC869_BC69PA Product data sheet BCP69; BC869; BC69PA [3] Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. ...
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... Contact information For more information, please visit: For sales office addresses, please send an email to: BCP69_BC869_BC69PA Product data sheet BCP69; BC869; BC69PA 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. Rev. 7 — ...
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... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document identifier: BCP69_BC869_BC69PA All rights reserved. Date of release: 12 October 2011 ...