74HC595N NXP Semiconductors, 74HC595N Datasheet - Page 19

• Manufacturer Part Number: 74HC595N
• Description: Shift Register Single 8-Bit Serial to Serial/Parallel 16-Pin PDIP Tube
• Manufacturer: NXP Semiconductors

Specifications of 74HC595N

• Package: 16PDIP
• Logic Function: Shift Register
• Logic Family: HC
• Operation Mode: Serial to Serial/Parallel
• Direction Type: Uni-Directional
• Number Of Element Outputs: 9
• Number Of Elements Per Chip: 1
• Typical Operating Supply Voltage: 5 V
• Operating Temperature: -40 to 125 °C
• Output Type: 3-State
• No. Of Elements: 1
• Ic Output Type: Tri State
• Logic Case Style: DIP
• No. Of Pins: 16
• Supply Voltage Range: 2V To 6V
• Operating Temperature Range: -40°C To +125°C
• Svhc: No SVHC
• Logic Type: Shift Register
• Shift Register Function: Serial To Parallel, Serial To Serial
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Philips Semiconductors
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
DIP
S
The maximum permissible temperature of the solder is
260 C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
R
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 C, contact may be up to 5 seconds.
1998 Jun 04
OLDERING BY DIPPING OR BY WAVE
EPAIRING SOLDERED JOINTS
8-bit serial-in/serial or parallel-out shift
register with output latches; 3-state
stg max
). If the
19
SO, SSOP and TSSOP
R
Reflow soldering techniques are suitable for all SO, SSOP
and TSSOP packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method.
Typical reflow temperatures range from 215 to 250 C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 C.
W
Wave soldering can be used for all SO packages. Wave
soldering is not recommended for SSOP and TSSOP
packages, because of the likelihood of solder bridging due
to closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
If wave soldering is used - and cannot be avoided for
SSOP and TSSOP packages - the following conditions
must be observed:
EFLOW SOLDERING
AVE SOLDERING
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow and must incorporate solder
thieves at the downstream end.
74HC/HCT595
Product specification