74HC595N NXP Semiconductors, 74HC595N Datasheet - Page 20

no-image

74HC595N

Manufacturer Part Number
74HC595N
Description
Shift Register Single 8-Bit Serial to Serial/Parallel 16-Pin PDIP Tube
Manufacturer
NXP Semiconductors
Datasheets

Specifications of 74HC595N

Package
16PDIP
Logic Function
Shift Register
Logic Family
HC
Operation Mode
Serial to Serial/Parallel
Direction Type
Uni-Directional
Number Of Element Outputs
9
Number Of Elements Per Chip
1
Typical Operating Supply Voltage
5 V
Operating Temperature
-40 to 125 °C
Output Type
3-State
No. Of Elements
1
Ic Output Type
Tri State
Logic Case Style
DIP
No. Of Pins
16
Supply Voltage Range
2V To 6V
Operating Temperature Range
-40°C To +125°C
Svhc
No SVHC
Logic Type
Shift Register
Shift Register Function
Serial To Parallel, Serial To Serial
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
74HC595N
Manufacturer:
TOSHIBA
Quantity:
12 400
Part Number:
74HC595N
Quantity:
8
Part Number:
74HC595N
Manufacturer:
ST
0
Part Number:
74HC595N
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Part Number:
74HC595N
Quantity:
2 250
Part Number:
74HC595NSR
Manufacturer:
TI/德州仪器
Quantity:
20 000
Philips Semiconductors
Even with these conditions:
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 C within
6 seconds. Typical dwell time is 4 seconds at 250 C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 Jun 04
Data sheet status
Objective specification
Preliminary specification
Product specification
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Only consider wave soldering SSOP packages that
have a body width of 4.4 mm, that is
SSOP16 (SOT369-1) or SSOP20 (SOT266-1).
Do not consider wave soldering TSSOP packages
with 48 leads or more, that is TSSOP48 (SOT362-1)
and TSSOP56 (SOT364-1).
8-bit serial-in/serial or parallel-out shift
register with output latches; 3-state
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
20
R
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 C.
EPAIRING SOLDERED JOINTS
74HC/HCT595
Product specification