XC2VP30-6FFG1152C Xilinx Inc, XC2VP30-6FFG1152C Datasheet - Page 225
![FPGA Virtex-II Pro™ Family 30816 Cells 1200MHz 0.13um/90nm (CMOS) Technology 1.5V 1152-Pin FCBGA](/photos/28/18/281832/xc2vp30-6ffg1152c__back__sml.jpg)
XC2VP30-6FFG1152C
Manufacturer Part Number
XC2VP30-6FFG1152C
Description
FPGA Virtex-II Pro™ Family 30816 Cells 1200MHz 0.13um/90nm (CMOS) Technology 1.5V 1152-Pin FCBGA
Manufacturer
Xilinx Inc
Series
Virtex™-II Pror
Datasheet
1.XC2VP20-5FGG676C.pdf
(430 pages)
Specifications of XC2VP30-6FFG1152C
Package
1152FCBGA
Family Name
Virtex-II ProÂ
Device Logic Units
30816
Number Of Registers
27392
Maximum Internal Frequency
1200 MHz
Typical Operating Supply Voltage
1.5 V
Maximum Number Of User I/os
644
Ram Bits
2506752
Number Of Logic Elements/cells
30816
Number Of Labs/clbs
3424
Total Ram Bits
2506752
Number Of I /o
644
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
1152-BBGA, FCBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
122-1364
Available stocks
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Quantity
Price
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Part Number:
XC2VP30-6FFG1152C
Manufacturer:
XilinxInc
Quantity:
3 000
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Part Number:
XC2VP30-6FFG1152C
Manufacturer:
Xilinx Inc
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Manufacturer:
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Quantity:
20 000
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Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Pinout Information
FF896 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 5: FF896 Flip-Chip Fine-Pitch BGA Package Specifications
www.xilinx.com
DS083 (v4.7) November 5, 2007
Module 4 of 4
Product Specification
97
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