PDTC124XT,215 NXP Semiconductors, PDTC124XT,215 Datasheet
PDTC124XT,215
Specifications of PDTC124XT,215
PDTC124XT T/R
PDTC124XT T/R
Related parts for PDTC124XT,215
PDTC124XT,215 Summary of contents
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PDTC124X series NPN resistor-equipped transistors kΩ kΩ Rev. 07 — 16 November 2009 1. Product profile 1.1 General description NPN Resistor-Equipped Transistors (RET) family. Table 1. Type number PDTC124XE PDTC124XEF PDTC124XK PDTC124XM PDTC124XS PDTC124XT ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin SOT54 SOT54A SOT54 variant SOT23; SOT323; SOT346; SOT416; SOT490 SOT883 PDTC124X_SER_7 Product data sheet NPN resistor-equipped transistors kΩ kΩ Pinning Description input (base) output (collector) GND (emitter) input (base) output (collector) GND (emitter) input (base) ...
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... NXP Semiconductors 3. Ordering information Table 4. Type number PDTC124XE PDTC124XEF PDTC124XK PDTC124XM PDTC124XS PDTC124XT PDTC124XU [1] Also available in SOT54A and SOT54 variant packages (see 4. Marking Table 5. Type number PDTC124XE PDTC124XEF PDTC124XK PDTC124XM PDTC124XS PDTC124XT PDTC124XU [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot T stg amb [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. ...
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... NXP Semiconductors 6. Thermal characteristics Table 7. Symbol R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. Device mounted on an FR4 PCB with 60 μm copper strip line, standard footprint. [3] 7. Characteristics Table 8. ° ...
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... NXP Semiconductors − 100 °C (1) T amb = 25 °C (2) T amb = −40 °C (3) T amb Fig 1. DC current gain as a function of collector current; typical values 10 V I(on) (V) (1) 1 (2) (3) −1 10 − 0 −40 °C (1) T amb = 25 °C (2) T amb = 100 °C (3) T amb Fig 3 ...
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... NXP Semiconductors 8. Package outline 1.8 1.4 3 1.75 0.9 1.45 0 Dimensions in mm Fig 5. Package outline SOT416 (SC-75) 0.62 0.55 0.55 0.47 3 0.30 0.22 0.65 0.30 0. 0.20 0.12 0.35 Dimensions in mm Fig 7. Package outline SOT883 (SC-101) 4.2 3.6 3 max 4.8 4.4 5.2 14.5 5 ...
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... NXP Semiconductors 3.0 2.8 3 2.5 1.4 2.1 1.2 1 1.9 Dimensions in mm Fig 11. Package outline SOT23 (TO-236AB) 1.7 1.5 Fig 13. Package outline SOT490 (SC-89) PDTC124X_SER_7 Product data sheet NPN resistor-equipped transistors kΩ kΩ 1.1 0.9 0.45 0.15 2.2 1.35 2.0 1.15 2 0.48 ...
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... NXP Semiconductors 9. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package PDTC124XE PDTC124XEF SOT490 PDTC124XK PDTC124XM PDTC124XS PDTC124XT PDTC124XU [1] For further information and the availability of packing methods, see PDTC124X_SER_7 Product data sheet NPN resistor-equipped transistors ...
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... Revision history Table 10. Revision history Document ID Release date PDTC124X_SER_7 20091116 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. PDTC124X_SER_6 20050714 PDTC124X_SERIES_5 20040813 PDTC124X_SERIES_4 20030410 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 13. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 5 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 Packing information . . . . . . . . . . . . . . . . . . . . . 9 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 11 Legal information ...