BT1306-400D,412 NXP Semiconductors, BT1306-400D,412 Datasheet - Page 4

• Manufacturer Part Number: BT1306-400D,412
• Description: TRIAC 400V 0.6A SOT54
• Manufacturer: NXP Semiconductors

Specifications of BT1306-400D,412

• Package / Case: TO-92-3 (Standard Body), TO-226
• Triac Type: Logic - Sensitive Gate
• Mounting Type: Through Hole
• Configuration: Single
• Current - Hold (ih) (max): 10mA
• Voltage - Off State: 400V
• Current - Gate Trigger (igt) (max): 5mA
• Current - Non Rep. Surge 50, 60hz (itsm): 8A, 8.8A
• Current - On State (it (rms)) (max): 600mA
• Voltage - Gate Trigger (vgt) (max): 2V
• Current - On State (it (rms) (max): 600mA
• Rated Repetitive Off-state Voltage Vdrm: 400 V
• Breakover Current Ibo Max: 8.8 A
• Off-state Leakage Current @ Vdrm Idrm: 0.1 mA
• Gate Trigger Voltage (vgt): 2 V
• Gate Trigger Current (igt): 7 mA
• Holding Current (ih Max): 10 mA
• Forward Voltage Drop: 1.9 V @ 0.85 A
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Repetitive Peak Forward Blocking Voltage: 400 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 934058132412; BT1306-400D; BT1306-400D

Philips Semiconductors
5. Thermal characteristics
Table 4:
9397 750 12593
Product data
Symbol
R
R
Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values.
th(j-lead)
th(j-a)
Z th(j-a)
(K/W)
10 3
10 2
10
1
Parameter
thermal resistance from junction to lead
thermal resistance from junction to ambient
10 -5
Thermal characteristics
5.1 Transient thermal impedance
10 -4
10 -3
Rev. 01 — 19 February 2004
Conditions
full cycle
half cycle
mounted on a printed-circuit board;
lead length = 4 mm;
10 -2
Figure 5
BT1306-400D/600D
10 -1
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Min
-
-
P
1
Typ
-
150
t p
t p (s)
Logic level triac
003aaa029
Max
60
80
-
t
10
Unit
K/W
K/W
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