SY89827LHG TR Micrel Inc, SY89827LHG TR Datasheet - Page 5

• Manufacturer Part Number: SY89827LHG TR
• Manufacturer: Micrel Inc
• Type: Clock Driverr

Specifications of SY89827LHG TR

• Number Of Clock Inputs: 4
• Mode Of Operation: Differential
• Output Frequency: 500MHz
• Output Logic Level: HSTL
• Operating Supply Voltage (min): 3.13V
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.47V
• Package Type: TQFP EP
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Signal Type: HSTL/LVPECL
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / RoHS Status: Compliant

Micrel, Inc.
Absolute Maximum Ratings
Power Supply Voltage (V
Input Voltage (V
Output Current (I
Lead Temperature (T
Storage Temperature (T
ESD Rating, Note 3 .................................................... >1kV
Power Supply
Symbol
V
V
I
HSTL Input/Output:
Symbol
V
V
V
V
V
I
I
Note 1.
Note 2.
Note 3.
Note 4.
Note 5.
M9999-073010
[e-mail] or [phone]
CCI
IH
IL
CCI
CCO
OH
OL
IH
IL
X
DC ELECTRICAL CHARACTERISTICS
Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratlng conditions
for extended periods may affect device reliability.
The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
Devices are ESD sensitive. Handling precautions recommended.
It is highly recommended to solder the exposed pad of the EPAD-TQFP package to a ground plane on the PCB for maximum thermal
efficiency.
Outputs loaded with 50Ω-to-ground.
Parameter
V
V
I
Parameter
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage
Input Crossover Voltage
Input HIGH Current
Input LOW Current
CC
: T
CC
CC
IN
OUT
Core
) ............................................ –0.5 to V
Core
Output
A
= –40°C to +85°C
) ............................................... –50mA
LEAD
V
CCI
S
CCI
) ............................ –65 to +150°C
, Soldering, 20sec.) .......... 260°C
= 3.3V ±5%, V
, V
CCO
) ............... –0.5 to +4.0V
(Note 1)
CCO
= 1.8V ±10%, T
Condition
No Load
Condition
Note 5
Note 5
CCI
A
= –40°C to +85°C
5
Operating Ratings
Supply Voltage
Ambient Temperature (T
Package Thermal Resistance
TQFP (θ
(V
(V
TQFP (θ
Exposed pad soldered to GND, Note 4
Exposed pad NOT soldered to GND (not recommended)
CCI
CCO
Still-Air (multi-layer PCB)
–200lfpm (multi-layer PCB)
–500lfpm (multi-layer PCB)
Still-Air (multi-layer PCB)
–200lfpm (multi-layer PCB)
–500lfpm (multi-layer PCB)
) ..................................................... +3.3V to +3.47V
) ..................................................... +1.6V to +2.0V
JA
JC
)
) ......................................................... 4.4°C/W
A
) .......................... –40°C to +85°C
(Note 2)
V
3.13
X
–0.3
0.68
.........................................
.........................................
Min
Min
+20
1.6
1.0
0.2
+0.1
.....................................
.....................................
.....................................
.....................................
Typ
140
Typ
3.3
1.8
Precision Edge
V
–350
–500
Max
3.47
Max
X
170
2.0
1.2
0.4
1.6
0.9
–0.1
SY89827L
23°C/W
18°C/W
15°C/W
44°C/W
36°C/W
30°C/W
Units
Units
mA
µA
µA
V
V
V
V
V
V
V
®