104130-5 TE Connectivity, 104130-5 Datasheet - Page 151

• Manufacturer Part Number: 104130-5
• Description: Conn Ejector Header HDR 26 POS 2.54mm Solder RA Thru-Hole
• Manufacturer: TE Connectivity
• Type: Ejector Headerr
• Series: AMP-LATCHr

Specifications of 104130-5

• Pitch: 2.54 mm
• Number Of Rows: 2
• Number Of Contacts: 26
• Gender: HDR
• Contact Plating: Gold Over Nickel
• Termination Method: Solder
• Connector Type: Wire To Board
• Contact Termination: Right Angle Through Hole
• No. Of Contacts: 26
• No. Of Rows: 2
• Pitch Spacing: 2.54mm
• Rohs Compliant: No
• Product Line: AMP-LATCH
• Profile: Low
• Pcb Mounting Orientation: Right Angle
• Pcb Mount Retention: Without
• Mating Connector Lock: Without
• Housing Style: 4-Sided
• Ejection Latches: With
• Post Size (mm [in]): 0.64 [.025]
• Shrouded: Yes
• [shrouded] End Dimension (mm [in]): 3.81 [0.150]
• Current Rating (a): 1
• Insulation Resistance (m?): 5,000
• Termination Post Length (mm [in]): 3.43 [0.135]
• Solder Tail Contact Plating: Tin-Lead over Nickel
• Header Type: Pin Header
• Number Of Positions: 26
• Centerline, Matrix (mm [in]): 2.54 x 2.54 [.100 x .100]
• Daisy Chain: With
• Preloaded: Yes
• Contact Plating, Mating Area, Material: Gold (30), Gold Flash over Palladium Nickel
• Contact Shape: Square
• Contact Base Material: Copper Alloy
• Connector Style: Header - Pin
• Mating Alignment Type: Center, Dual Polarizing Bar
• Mating Alignment: With
• Housing Material: Thermoplastic - GF
• Ul Flammability Rating: UL 94V-0
• Housing Color: Black
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Not suitable for lead free processing
• Approved Standards: UL E28476, CSA LR7189
• Operating Temperature (°c): -65 – +105
• Temperature Rating: Standard

PC Board Thickness
ACTION PIN posts are
designed for use in a variety
of PC board thicknesses.
However, certain ACTION
PIN posts are to be used in
specific ranges of board
thicknesses. To promote
optimum
performance, the
recommended board
thicknesses provided with
the connector being used
must be followed.
ACTION PIN Post/PC Board Applications
*Maximum hardness of copper layer is 150 Knoop.
**Radial hole distortion.
Note: Recommended annular ring diameter is hole diameter plus .020 [0.51].
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
ACTION PIN Contact
Material Thickness
.025 [0.64]
.0453
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
Drilled Hole
Diameter
±.001
[1.151
AMPMODU Interconnection System
ACTION PIN Press-Fit Posts
ACTION PIN posts provide a more reliable press-fit
connection. Localized pressure in the interface area provides
oxide break-through and prevents corrosion better in many
of the harshest environments to help provide a reliable
connection. Also, radial and axial distortion are controlled to
meet today’s standards for multilayer board applications.
➁
±0.03
]
.001-.003 [0.03-0.08] .0003 [0.008]Min.
Copper
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Plating Thicknesses
➂
*
➄
➁
Tin-lead
(Continued)
➃
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
➀
➃
.037-.043 [0.94-1.09]
➂
Plated-Through
Hole Diameter
➄
➀ Annular Ring (See Note)
➁ Drilled Hole
➂ Copper Thickness
➃ Tin-lead Thickness
➄ Plated-Through Hole
.0015 [0.038]
Average
Distortion Specification*
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
Maximum
.002 [0.05]
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