532956-6 TE Connectivity, 532956-6 Datasheet - Page 151

• Manufacturer Part Number: 532956-6
• Description: Conn Socket Strip RCP 36 POS 2.54mm Solder RA Thru-Hole
• Manufacturer: TE Connectivity
• Type: Socket Stripr

Specifications of 532956-6

• Pitch: 2.54 mm
• Number Of Rows: 2
• Number Of Contacts: 36
• Gender: RCP
• Contact Plating: Gold Over Nickel
• Termination Method: Solder
• Rohs Compliant: NO
• Connector Type: Connector Assembly
• Pcb Mount Retention: Without
• Pcb Mounting Orientation: Right Angle
• Termination Method To Pc Board: Through Hole - Solder
• Contact - Rated Current (a): 3
• Voltage (vac): 250
• Dielectric Withstanding Voltage (v): 750
• Termination Resistance (m?): 12
• Insulation Resistance (m?): 1,000
• Termination Post Length (mm [in]): 2.92 [0.115]
• Termination End Plating: Tin-Lead over Nickel
• Centerline (mm [in]): 2.54 [0.100]
• Number Of Positions: 36
• Row-to-row Spacing (mm [in]): 2.54 [0.100]
• Mating Retention: Without
• Assembly Process Feature: Board Standoff
• Contact Type: Socket
• Contact Plating, Mating Area, Material: Gold (30)
• Contact Base Material: Phosphor Bronze
• Connector Style: Receptacle
• Mating Alignment: With
• Mating Alignment Type: Guide Pin Slot
• Housing Material: Thermoplastic - GF
• Housing Color: Black
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: ELV compliant, 5 of 6 Compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Approved Standards: UL E28476, CSA LR7189
• Pcb Thickness, Recommended (mm [in]): 1.57 [0.062]
• High Temperature Compatible: Yes
• Temperature Range (°c): -65 – +105
• Contact Transmits (typical Application): Signal (Data)

PC Board Thickness
ACTION PIN posts are
designed for use in a variety
of PC board thicknesses.
However, certain ACTION
PIN posts are to be used in
specific ranges of board
thicknesses. To promote
optimum
performance, the
recommended board
thicknesses provided with
the connector being used
must be followed.
ACTION PIN Post/PC Board Applications
*Maximum hardness of copper layer is 150 Knoop.
**Radial hole distortion.
Note: Recommended annular ring diameter is hole diameter plus .020 [0.51].
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
ACTION PIN Contact
Material Thickness
.025 [0.64]
.0453
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
Drilled Hole
Diameter
±.001
[1.151
AMPMODU Interconnection System
ACTION PIN Press-Fit Posts
ACTION PIN posts provide a more reliable press-fit
connection. Localized pressure in the interface area provides
oxide break-through and prevents corrosion better in many
of the harshest environments to help provide a reliable
connection. Also, radial and axial distortion are controlled to
meet today’s standards for multilayer board applications.
➁
±0.03
]
.001-.003 [0.03-0.08] .0003 [0.008]Min.
Copper
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Plating Thicknesses
➂
*
➄
➁
Tin-lead
(Continued)
➃
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
➀
➃
.037-.043 [0.94-1.09]
➂
Plated-Through
Hole Diameter
➄
➀ Annular Ring (See Note)
➁ Drilled Hole
➂ Copper Thickness
➃ Tin-lead Thickness
➄ Plated-Through Hole
.0015 [0.038]
Average
Distortion Specification*
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
Maximum
.002 [0.05]
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