532956-6 TE Connectivity, 532956-6 Datasheet - Page 43

• Manufacturer Part Number: 532956-6
• Description: Conn Socket Strip RCP 36 POS 2.54mm Solder RA Thru-Hole
• Manufacturer: TE Connectivity
• Type: Socket Stripr

Specifications of 532956-6

• Pitch: 2.54 mm
• Number Of Rows: 2
• Number Of Contacts: 36
• Gender: RCP
• Contact Plating: Gold Over Nickel
• Termination Method: Solder
• Rohs Compliant: NO
• Connector Type: Connector Assembly
• Pcb Mount Retention: Without
• Pcb Mounting Orientation: Right Angle
• Termination Method To Pc Board: Through Hole - Solder
• Contact - Rated Current (a): 3
• Voltage (vac): 250
• Dielectric Withstanding Voltage (v): 750
• Termination Resistance (m?): 12
• Insulation Resistance (m?): 1,000
• Termination Post Length (mm [in]): 2.92 [0.115]
• Termination End Plating: Tin-Lead over Nickel
• Centerline (mm [in]): 2.54 [0.100]
• Number Of Positions: 36
• Row-to-row Spacing (mm [in]): 2.54 [0.100]
• Mating Retention: Without
• Assembly Process Feature: Board Standoff
• Contact Type: Socket
• Contact Plating, Mating Area, Material: Gold (30)
• Contact Base Material: Phosphor Bronze
• Connector Style: Receptacle
• Mating Alignment: With
• Mating Alignment Type: Guide Pin Slot
• Housing Material: Thermoplastic - GF
• Housing Color: Black
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: ELV compliant, 5 of 6 Compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Approved Standards: UL E28476, CSA LR7189
• Pcb Thickness, Recommended (mm [in]): 1.57 [0.062]
• High Temperature Compatible: Yes
• Temperature Range (°c): -65 – +105
• Contact Transmits (typical Application): Signal (Data)

Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Product Facts
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Surface-mount option for
parallel board-to-board
applications; completely
intermateable with
AMPMODU System 50
thru-hole board-to-board
and cable-to-board systems
Double row, vertical,
shrouded header and
receptacle assemblies
Available in select sizes
from 10 through 100
positions
High Density; contacts
spaced on .050 x .100 [1.27
x 2.54] centers; compact
footprint
Compatible with standard
surface-mount processes
Stand-offs for free drainage
of flux cleaning solutions;
visible solder joints for easy
inspection
Simple, low insertion-force
holddown for process
retention and long-term
strain relief for solder joints
Available in tape and reel
packaging (with vacuum
covers) for automatic
placement.
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
AMPMODU Interconnection System
Surface-Mount Connectors, .050 x .100 [1.27 x 2.54] Centerline,
Board-to-Board
The high-density surface-
mount connector is another
mounting option in the
AMPMODU System 50
connector family.
This surface-mount system
is fully intermateable with
the AMPMODU System 50
thru-hole and cable-to-
board connectors.
Additionally, the design of
the mating interface has not
been changed, maintaining
the same high reliability as
the thru-hole product.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
The surface-mount system
includes double row,
vertical, shrouded header
and receptacle assemblies
in select sizes from 10
through 100 positions. It
meets the tight dimensional
requirements of surface-
mount technology. The
simple, low insertion-force
holddown provides both
processing retention and
long-term strain relief for
the solder joints in the
headers and receptacles.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
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