5-146252-8 TE Connectivity, 5-146252-8 Datasheet - Page 3

• Manufacturer Part Number: 5-146252-8
• Description: Conn Unshrouded Header HDR 16 POS 2.54mm Solder ST Thru-Hole
• Manufacturer: TE Connectivity
• Type: Unshrouded Headerr
• Series: AMPMODU MOD II Seriesr

Specifications of 5-146252-8

• Pitch: 2.54 mm
• Number Of Rows: 2
• Number Of Contacts: 16
• Gender: HDR
• Contact Plating: Gold Over Nickel
• Termination Method: Solder
• Product Type: Headers - Breakaway
• Number Of Positions / Contacts: 16
• Row Spacing: 2.54 mm
• Mounting Style: SMD/SMT
• Mounting Angle: Vertical
• Termination Style: Solder
• Housing Material: Thermoplastic, Glass Filled
• Contact Material: Phosphor Bronze
• Current Rating: 3 A
• Operating Temperature Range: - 65 C to + 105 C
• Mount Angle: Vertical
• Pcb Mount Retention: Without
• Surface Mount Compatible: Yes
• Board Standoff: With
• Mounting Ears: Without
• Mating Connector Lock: Without
• Post Size (mm [in]): 0.64 [.025]
• Mating Post Length (mm [in]): 8.08 [0.318]
• Panel Mount Retention: Without
• Current Rating (a): 3
• Insulation Resistance (m?): 5,000
• Dielectric Withstanding Voltage (v): 750
• Termination Post Length (mm [in]): 3.18 [0.125]
• Solder Tail Contact Plating: Tin over Nickel, Matte Tin over Nickel
• Header Type: Breakaway
• Number Of Positions: 16
• Centerline (mm [in]): 2.54 [0.100]
• Row-to-row Spacing (mm [in]): 2.54 [0.100]
• Selectively Loaded: No
• Mount Type: Printed Circuit Board
• Contact Plating, Mating Area, Material: Gold (15)
• Contact Shape: Square
• Contact Base Material: Phosphor Bronze
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C, Reflow solder capable to 245°C, Reflow solder capable to 260°C, Pin-in-Paste capable to 245°C, Pin-in-Paste capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Approved Standards: UL E28476, CSA LR7189
• Operating Temperature (°c): -65 – +105
• High Temperature Housing: Yes
• High Speed Serial Data Connector: No
• Lead Free Status / Rohs Status: Details

Catalog 1307819
Revised 8-08
www.tycoelectronics.com
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
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AMPMODU Interconnection System
Table of Contents
AMPMODU 2mm Connectors
.100 [2.54] x .100 [2.54] CENTERLINE
AMPMODU 2mm Connectors (Board to Board) ……………………………………………65
Headers, Unshrouded, Double Row, Thru-Hole Mount ………………………………66, 67
Breakaway Headers, Unshrouded, Double Row, Thru-Hole Mount …………………68-70
Breakaway Headers, Unshrouded, Double Row, Surface Mount ……………………71, 72
Stacking Header, Unshrouded, Double Row, Thru-Hole Mount …………………………73
Headers, Shrouded, Double Row, Thru-Hole, Right-Angle Mount …………………74, 75
Headers, Shrouded, Double Row, Surface Mount ……………………………………76, 77
Headers, Shrouded, Double Row, Thru-Hole Mount with Cable Shrouds …………78, 79
Receptacles, Double Row, Thru-Hole, Vertical Mount…………………………………80, 81
Receptacles, Double Row, Surface Mount, Right-Angle Mount …………………………82
Receptacles, Double Row, Thru-Hole, Right-Angle Mount ………………………………83
Receptacles, Double Row, Surface Mount, Vertical Mount ………………………………84
Introduction ………………………………………………………………………………85-87
Terms Explained ………………………………………………………………………………87
Wire Sizes………………………………………………………………………………………88
Contact Platings ………………………………………………………………………………88
Mating Post Lengths …………………………………………………………………………88
Application Tooling …………………………………………………………………………88
Board-to-Board Solutions Guides, .100[2.54] Centerline Products …………………89
Wire-to-Board Solutions Guide, .100[2.54] Centerline Products ……………………89
Mating Post Selection Guide ………………………………………………………………90
Parallel Stacking Guide for Board-to-Board Applications ……………………………91
Board-to-Board Products:
Wire-to-Board Products:
Application Tooling ……………………………………………………………………270-275
Technical Documents …………………………………………………………………276-278
Unshrouded Headers ………………………………………………………………92-100
Breakaway and Retention Headers-Unshrouded ………………………………101-105
Reeled Breakaway Headers ………………………………………………………106, 107
Surface Mount Breakaway Headers ………………………………………………108-110
Unshrouded Stacking Headers- Breakaway ……………………………………111-113
Shrouded Headers …………………………………………………………………114-140
Shrouded Stacking Headers ………………………………………………………141-144
ACTION PIN Headers ………………………………………………………………145-149
ACTION PIN Press-Fit Posts ………………………………………………………150, 151
ACTION PIN Stacking Connectors ………………………………………………154-161
0.025 [0.64] Square Posts ………………………………………………………………163
0.025 [0.64] Square Continuous Posts……………………………………………164, 165
0.045 [1.14] Square Continuous Posts……………………………………………166, 167
Horizontal Mount Receptacle Assemblies, Mod II ………………………………168-173
Vertical Mount Receptacle Assemblies, Mod II & Mod IV ………………………174-184
Surface Mount Vertical Receptacles, Mod IV ……………………………………185-192
Two-Piece Printed Circuit Board Connectors ……………………………………193-202
Accessories …………………………………………………………………………203-205
Locking Clip Contacts and Housings ……………………………………………206-209
Mod IV Contacts and Housings ……………………………………………………210-220
Short Point Contacts and Housings ………………………………………………221-224
MTE Interconnection System ………………………………………………………225-250
MT and Shielded MT Connectors …………………………………………………255-265
Mini-Tandem Spring Receptacle Contacts ………………………………………266-269
Standard Profile ……………………………………………………………………114-133
Low Profile …………………………………………………………………………134-140
Application Tooling for ACTION PIN Posts ……………………………………152, 153
Application Tooling for AMP ACTION PIN Stacking Connectors …………………162
Surface Mount MTE Headers (Right-Angle & Vertical) ………………………251, 252
Interchangeable Contacts, Wire Crimp (Snap-In) ……………………………253, 254
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
(Continued)
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
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