5-146252-8 TE Connectivity, 5-146252-8 Datasheet - Page 36

• Manufacturer Part Number: 5-146252-8
• Description: Conn Unshrouded Header HDR 16 POS 2.54mm Solder ST Thru-Hole
• Manufacturer: TE Connectivity
• Type: Unshrouded Headerr
• Series: AMPMODU MOD II Seriesr

Specifications of 5-146252-8

• Pitch: 2.54 mm
• Number Of Rows: 2
• Number Of Contacts: 16
• Gender: HDR
• Contact Plating: Gold Over Nickel
• Termination Method: Solder
• Product Type: Headers - Breakaway
• Number Of Positions / Contacts: 16
• Row Spacing: 2.54 mm
• Mounting Style: SMD/SMT
• Mounting Angle: Vertical
• Termination Style: Solder
• Housing Material: Thermoplastic, Glass Filled
• Contact Material: Phosphor Bronze
• Current Rating: 3 A
• Operating Temperature Range: - 65 C to + 105 C
• Mount Angle: Vertical
• Pcb Mount Retention: Without
• Surface Mount Compatible: Yes
• Board Standoff: With
• Mounting Ears: Without
• Mating Connector Lock: Without
• Post Size (mm [in]): 0.64 [.025]
• Mating Post Length (mm [in]): 8.08 [0.318]
• Panel Mount Retention: Without
• Current Rating (a): 3
• Insulation Resistance (m?): 5,000
• Dielectric Withstanding Voltage (v): 750
• Termination Post Length (mm [in]): 3.18 [0.125]
• Solder Tail Contact Plating: Tin over Nickel, Matte Tin over Nickel
• Header Type: Breakaway
• Number Of Positions: 16
• Centerline (mm [in]): 2.54 [0.100]
• Row-to-row Spacing (mm [in]): 2.54 [0.100]
• Selectively Loaded: No
• Mount Type: Printed Circuit Board
• Contact Plating, Mating Area, Material: Gold (15)
• Contact Shape: Square
• Contact Base Material: Phosphor Bronze
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C, Reflow solder capable to 245°C, Reflow solder capable to 260°C, Pin-in-Paste capable to 245°C, Pin-in-Paste capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Approved Standards: UL E28476, CSA LR7189
• Operating Temperature (°c): -65 – +105
• High Temperature Housing: Yes
• High Speed Serial Data Connector: No
• Lead Free Status / Rohs Status: Details

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Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Product Facts
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High density; contacts
spaced on .050 x .100
[1.27 x 2.54] centers
Right-angle and vertical
styles
Single row; select sizes 5
thru 50 positions
Double row; select sizes 10
thru 100 positions
Contacts are selectively
plated with gold
Stand-offs for removal of
solder flux
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
AMPMODU Interconnection System
Thru-Hole Receptacles, .050 x .100 [1.27 x 2.54] Centerline,
Board-to-Board
The AMPMODU System 50
thru-hole receptacles offer
a wide variety of high
density board-to-board
connectors. The .050 [1.27]
spacing between each
contact provides an
extremely dense
interconnect package and
results in a more efficient
use of the printed circuit
board space.
AMPMODU System 50
thru-hole receptacles are
available in right-angle and
vertical configurations and
are composed of single
and double row versions.
The single row versions are
available in select sizes of
5 thru 50 positions and
double row in positions
from 10 thru 100.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Receptacle contacts and
mating .015 [0.38] square
posts are formed from high
conductivity copper alloy
and are selectively plated
with gold for higher
performance and reliability.
The receptacle housings
are made of black
thermoplastic, with a 94V-0
rating to withstand high
temperatures of reflow
soldering and incorporate
stand-offs for free drainage
of flux cleaning solutions.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208